Texas Instruments TMS320 specifications RS, INT, BIO, and XF Timing, Hold Timing, Hold Holda

Page 25

TMS32020

SPRS010B Ð MAY 1987 Ð REVISED NOVEMBER 1990

RS, INT, BIO, AND XF TIMING

switching characteristics over recommended operating conditions (see Note 3 and 8)

 

 

 

PARAMETER

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

 

 

 

td(RS)

CLKOUT1 low to reset state entered

 

 

45

ns

td(IACK)

CLKOUT1 to

 

valid

± 25

0

25

ns

IACK

td(XF)

XF valid before falling edge of

 

 

Q ± 30

 

 

ns

STRB

 

 

 

NOTES: 3. Q = 1/4tc(C).

8.RS, INT, and BIO are asynchronous inputs and can occur at any time during a clock cycle. However, if the specified setup time is met, the exact sequence shown in the timing diagrams will occur.

timing requirements over recommended operating conditions (see Note 3 and 8)

 

 

 

 

 

 

 

 

 

MIN

NOM MAX

UNIT

 

 

 

 

 

 

 

 

 

 

tsu(IN)

 

 

 

 

 

 

 

 

50

 

ns

 

INT/BIO/RS setup before CLKOUT1 high

 

th(IN)

 

 

 

 

 

 

 

 

0

 

ns

INT/BIO/RS hold after CLKOUT1 high

 

t

 

 

 

 

 

 

 

 

 

15²

ns

INT/BIO fall time

 

f(IN)

 

 

 

 

 

 

 

 

 

 

 

tw(IN)

 

 

 

 

 

 

 

 

tc(C)

 

ns

 

INT/BIO low pulse duration

 

tw(RS)

 

 

low pulse duration

3tc(C)

 

ns

RS

 

²Value derived from characterization data and not tested. NOTES: 3. Q = 1/4tc(C).

8.RS, INT, and BIO are asynchronous inputs and can occur at any time during a clock cycle. However, if the specified setup time is met, the exact sequence shown in the timing diagrams will occur.

HOLD TIMING

switching characteristics over recommended operating conditions (see Note 3)

 

 

 

 

 

PARAMETER

MIN

TYP MAX

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

t

 

 

low after CLKOUT1 low

±25²

25

ns

HOLDA

d(C1L-AL)

 

 

 

 

 

 

 

 

 

 

 

 

tdis(AL-A)

 

 

low to address three-state

 

15²

ns

HOLDA

 

tdis(C1L-A)

Address three-state after CLKOUT1 low

 

 

mode, see Note 9)

 

30²

ns

(HOLD

 

td(HH-AH)

 

high to

 

high

 

50

ns

HOLD

HOLDA

 

ten(A-C1L)

Address driven before CLKOUT1 low

 

 

mode, see Note 9)

 

10²

ns

(HOLD

 

²Value derived from characterization data and not tested. NOTES: 3. Q = 1/4tc(C).

9.A15-A0, PS, DS, IS, STRB, and R/W timings are all included in timings referenced as ªaddress.º

timing requirements over recommended operating conditions (see Note 3)

 

 

 

MIN NOM

MAX

UNIT

 

 

 

 

td(C2H-H)

 

valid after CLKOUT2 high

 

Q ± 45

ns

HOLD

 

NOTE 3: Q = 1/4tc(C).

ADVANCE INFORMATION

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Contents Description TMS320 SECOND-GENERATION Digital Signal ProcessorsPGA and PLCC/CER-QUAD PIN Assignments Signals DefinitionFunction PIN Introduction Bit-Reversed Indexed-Addressing Mode for Key Features TMS32020Memory Space Wait States for Communication to Slower Off-ChipTMS320 Second-Generation Device Overview ArchitecturePackage TypeSECOND-GENERATION Devices Functional block diagram TMS320C2xScaling shifter Timer16 ⋅ 16-bit parallel multiplier Memory controlMemory Maps TMS320 SECOND-GENERATION DevicesExternal interface Interrupts and subroutinesMultiprocessing Instruction set Repeat featureAddressing modes Symbol Definition Instruction SymbolsInstruction set summary TMS320C25 Instruction Set Summary XOR SUBT²XORK² ZACLPH ² ApacLTA LTP ²Data Memory Operations Mnemonic Description Words TMS320C25 Instruction Set Summary concluded TMS32020 Product Notification TMS32020Development support Software Tools Part Number TMS320 Second-Generation Software and Hardware SupportHardware Tools Part Number Documentation support Specification overviewMIN NOM MAX Unit Recommended operating conditionsParameter Test Conditions MIN TYP§ MAX Unit Internal clock option Clock Characteristics and TimingExternal clock option Test Load Circuit Parameter MIN TYP MAX Unit Memory and Peripheral Interface TimingHold Timing RS, INT, BIO, and XF TimingHold Holda Serial Port Timing MP/MC IOH INT Clkin / Clkx / ClkrTMS320C25GBA Parameter Test Conditions MIN TYP MAX Unit Clkin External Clock OptionVOH Min TdC1L-AL Low after CLKOUT1 low Serial Port Timing See Notes 14 Eprom ProgrammingVPP IPP1CLKIN, CLKX, Clkr INT0 INT2 VIHMP/MC VIL CLKOUT1, CLKOUT2 Internal Clock Option External clock optionFcrystal TdC1-S From Clkout if Is present TsuIN Setup before CLKOUT1 high Clock characteristics and timing Contrast Summary of Electrical SpecificationsParameter MIN TYP MAXRS, INT, BIO, and XF timing Memory and peripheral interface timingHold timing Serial port timingClock timing Timing DiagramsBR, PS, D S Memory read timingReady CLKOUT1 CLKOUT2 Strb Memory write timingMSC One wait-state memory access timingIack Reset timingInterrupt timing TMS320C25 Interrupt timing TMS32020Serial port transmit timing Serial port receive timingExternal flag timing BIO timingPC = N PC = N + Hold Hold timing part aHolda ExecuteCLKOUT1 CLKOUT2 Hold timing part BHolda Fetch Fetch Execute Or is D15-D0 TdHH-AH TMS320C25FNL Plcc reflow soldering precautions Typical Supply Current Characteristics for TMS320C25Pin GB grid array ceramic package TMS32020, TMS320C25 Mechanical DataParameter MAX Unit Advance Jedec NO. Outline Terminals MIN MAX Fast programming and verification Programming the TMS320E25 Eprom cellVCC Pin Nomenclature TMS320E25EPT EPT VPPSignal TMS320E25 Programming Mode LevelsProgram Read Output Name ² PIN Verify Inhibit Disable ErasureProgram verify Fast Programming FlowchartRead Output disableROM protection and verification Eprom protect TMS320E25 Protect and Verify Eprom Mode LevelsVIH VIL PGM VPP VCC VSS Clkin EPT VPPRbit EpromVCC VIH VIL PGM VIH/VOH HI-Z VIL/VOL VPP EPT VSS VIH VIL VPP VCCTMS320 SECOND-GENERATION NIL Other Qualified Versions of TMS320C25 Packaging InformationImportant Notice
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