Texas Instruments specifications SECOND-GENERATION Devices, Functional block diagram TMS320C2x

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TMS320

SECOND-GENERATION

DEVICES

SPRS010B Ð MAY 1987 Ð REVISED NOVEMBER 1990

functional block diagram (TMS320C2x)

SYNC

Program Bus

IS

X1

X2/CLKIN CLKOUT1 CLKOUT2

16

DS

PS

16

16

16

R/W

PFC(16)

QIR(16)

IR(16)

STRB

16

READY

STO(16)

MUX

BR

Controller

16

IFR(6)

HOLDA

XF

16

16

RPTC(8)

HOLD

MSC

MCS(16)

PC(16)

DR

BIO

CLKR

RS

16

16

16

FSR

IACK

DX

Address

Stack

CLKX

MP/MC

16

16

FSX

3

16

INT(2-0)

Program

(8 x 16)

RSR(16)

16

ROM/

XSR(16)

16

EPROM

16

DRR(16)

A15-A0

MUX

(4096 ⋅16)

16

DXR(16)

Instruction

16

TIM(16)

16

16

PRD(16)

6

IMR(6)

16

16

8

GREG(8)

D15-D0

MUX

16

16

16

Data Bus

Program Bus

16

16

16

16

9

16

16

16

3

AR0(16)

7 LSB

TR(16)

AR1(16)

MUX

3

From IR

ARP(3)

AR2(16)

DP(9)

Multiplier

16

AR3(16)

Shifter(0-16)

AR4(16)

9

3

AR5(16)

PR(32)

AR6(16)

AR7(16)

16

32

32

ARB(3)

Shifter(-6, 0, 1, 4)

16

16

32

3

MUX

ARAU(16)

16

MUX

16

32

MUX

MUX

16

16

32

ALU(32)

Block B2 (32 ⋅16)

Data RAM

Block B1

(256 ⋅16)

16

Data Bus

DATA/PROG

RAM (256 ⋅16)

Block B0

16

MUX

16

32

C ACCH(16) ACCL(16)

32

Shifters (0-7)²

1616

LEGEND:
ACCH	=	Accumulator high	IFR	=	Interrupt flag register		PC	=	Program counter
ACCL	=	Accumulator low	IMR	=	Interrupt mask register		PFC	=	Prefetch counter
ALU	=	Arithmetic logic unit	IR	=	Instruction register		RPTC	=	Repeat instruction counter
ARAU	=	Auxiliary register arithmetic unitMCS	=	Microcall stack		GREG	=	Global memory allocation register
ARB	=	Auxiliary register pointer buffer	QIR	=	Queue instruction register		RSR	= Serial port receive shift register
ARP	=	Auxiliary register pointer	PR	=	Product register		XSR	= Serial port transmit shift register
DP	=	Data memory page pointer	PRD	= Period register for timer			AR0-AR7	=	Auxiliary registers
DRR	=	Serial port data receive registerTIM	=	Timer		ST0, ST1		=	Status registers
DXR	=	Serial port data transmit register	TR	=	Temporary register		C	=	Carry bit

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Image 6

Contents TMS320 SECOND-GENERATION Digital Signal Processors DescriptionSignals Definition PGA and PLCC/CER-QUAD PIN AssignmentsFunction PIN Introduction Memory Space Key Features TMS32020Bit-Reversed Indexed-Addressing Mode for Wait States for Communication to Slower Off-ChipPackage ArchitectureTMS320 Second-Generation Device Overview TypeFunctional block diagram TMS320C2x SECOND-GENERATION Devices16 ⋅ 16-bit parallel multiplier TimerScaling shifter Memory controlTMS320 SECOND-GENERATION Devices Memory MapsInterrupts and subroutines External interfaceMultiprocessing Repeat feature Instruction setAddressing modes Instruction Symbols Symbol DefinitionInstruction set summary TMS320C25 Instruction Set Summary XORK² SUBT²XOR ZACLTA ApacLPH ² LTP ²Data Memory Operations Mnemonic Description Words TMS320C25 Instruction Set Summary concluded TMS32020 TMS32020 Product NotificationDevelopment support TMS320 Second-Generation Software and Hardware Support Software Tools Part NumberHardware Tools Part Number Specification overview Documentation supportRecommended operating conditions MIN NOM MAX UnitParameter Test Conditions MIN TYP§ MAX Unit Clock Characteristics and Timing Internal clock optionExternal clock option Test Load Circuit Memory and Peripheral Interface Timing Parameter MIN TYP MAX UnitRS, INT, BIO, and XF Timing Hold TimingHold Holda Serial Port Timing INT Clkin / Clkx / Clkr MP/MC IOHTMS320C25GBA Parameter Test Conditions MIN TYP MAX Unit External Clock Option ClkinVOH Min TdC1L-AL Low after CLKOUT1 low Serial Port Timing VPP Eprom ProgrammingSee Notes 14 IPP1INT0 INT2 VIH CLKIN, CLKX, ClkrMP/MC VIL Internal Clock Option External clock option CLKOUT1, CLKOUT2Fcrystal TdC1-S From Clkout if Is present TsuIN Setup before CLKOUT1 high Parameter Contrast Summary of Electrical SpecificationsClock characteristics and timing MIN TYP MAXHold timing Memory and peripheral interface timingRS, INT, BIO, and XF timing Serial port timingTiming Diagrams Clock timingMemory read timing BR, PS, D SReady Memory write timing CLKOUT1 CLKOUT2 StrbOne wait-state memory access timing MSCReset timing IackInterrupt timing TMS32020 Interrupt timing TMS320C25Serial port receive timing Serial port transmit timingBIO timing External flag timingPC = N PC = N + Holda Hold timing part aHold ExecuteHold timing part B CLKOUT1 CLKOUT2Holda Fetch Fetch Execute Or is D15-D0 TdHH-AH Typical Supply Current Characteristics for TMS320C25 TMS320C25FNL Plcc reflow soldering precautionsMechanical Data Pin GB grid array ceramic package TMS32020, TMS320C25Parameter MAX Unit Advance Jedec NO. Outline Terminals MIN MAX Programming the TMS320E25 Eprom cell Fast programming and verificationEPT Pin Nomenclature TMS320E25VCC EPT VPPProgram Read Output Name ² PIN Verify Inhibit Disable TMS320E25 Programming Mode LevelsSignal ErasureFast Programming Flowchart Program verifyOutput disable ReadROM protection and verification VIH VIL PGM VPP VCC TMS320E25 Protect and Verify Eprom Mode LevelsEprom protect VSS Clkin EPT VPPEprom RbitVIH VIL VPP VCC VCC VIH VIL PGM VIH/VOH HI-Z VIL/VOL VPP EPT VSSTMS320 SECOND-GENERATION NIL Packaging Information Other Qualified Versions of TMS320C25Important Notice