General Memory Module Installation Guidelines
This system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural configuration. The following are the recommended guidelines for best performance:
•UDIMMs and RDIMMs must not be mixed.
•x4 and x8 DRAM based DIMMs can be mixed. For more information, see
•A maximum of two UDIMMs can be populated in a channel.
•A maximum of two single- or dual- or
•One
•Populate DIMM sockets only if a processor is installed. For
•Populate all sockets with white release tabs first and then black.
•Populate the sockets by highest rank count in the following order - first in sockets with white release levers and then black. For example, if you want to mix
•In a
•Memory modules of different sizes can be mixed provided that other memory population rules are followed (for example, 2 GB and 4 GB memory modules can be mixed).
•Depending on
•If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or slower depending on system DIMM configuration.
Mode-Specific Guidelines
Three memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.
NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for (Reliability, Availability, and Serviceability) RAS features. However, all guidelines for specific RAS features must be followed. x4 DRAM based DIMMs retain Single Device Data Correction (SDDC) in either memory optimized (independent channel) or Advanced ECC modes. x8 DRAM based DIMMs require Advanced ECC mode to gain SDDC.
The following sections provide additional slot population guidelines for each mode.
Advanced ECC (Lockstep)
Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single DRAM chip failures during normal operation.
Memory installation guidelines:
•Memory sockets A1, A4, B1, and B4 are disabled and do not supported Advanced ECC mode.
•DIMMs must be installed in matched pairs — DIMMs installed in memory sockets (A2, B2) must match DIMMs installed in memory sockets (A3, B3) and DIMMs installed in memory sockets (A5, B5) must match DIMMs installed in memory sockets (A6, B6).
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