Package Mechanical Specifications—Processor

8.0Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard using the LGA1150 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. The following figure shows a sketch of the processor package components and how they are assembled together.

The package components shown in the following figure include the following:

1.Integrated Heat Spreader (IHS)

2.Thermal Interface Material (TIM)

3.Processor core (die)

4.Package substrate

5.Capacitors

Figure 20. Processor Package Assembly Sketch

8.1Processor Component Keep-Out Zone

The processor may contain components on the substrate that define component keep- out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to the land-side of the package substrate. Refer to the LGA1150 Socket Application Guide for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

8.2Package Loading Specifications

The following table provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any

 

Intel® Xeon® Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

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