
Package Mechanical
Table 52. | Processor Materials |
|
|
|
|
| Component | Material |
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|
|
| Integrated Heat Spreader (IHS) | Nickel Plated Copper |
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| Substrate | Fiber Reinforced Resin |
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| Substrate Lands | Gold Plated Copper |
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|
|
8.7 Processor Markings
The following figure shows the
Figure 21. Processor
8.8Processor Land Coordinates
The following figure shows the bottom view of the processor package.
| Intel® Xeon® Processor |
June 2013 | Datasheet – Volume 1 of 2 |
Order No.: | 103 |