Package Mechanical Specifications—Processor

Table 52.

Processor Materials

 

 

 

 

 

Component

Material

 

 

 

 

Integrated Heat Spreader (IHS)

Nickel Plated Copper

 

 

 

 

Substrate

Fiber Reinforced Resin

 

 

 

 

Substrate Lands

Gold Plated Copper

 

 

 

8.7 Processor Markings

The following figure shows the top-side markings on the processor. This diagram aids in the identification of the processor.

Figure 21. Processor Top-Side Markings

8.8Processor Land Coordinates

The following figure shows the bottom view of the processor package.

 

Intel® Xeon® Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

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