Processor—Introduction

 

 

 

 

Term

Description

 

 

 

 

 

Non-Critical to Function. NCTF locations are typically redundant ground or non-critical

 

NCTF

reserved, so the loss of the solder joint continuity at end of life conditions will not

 

 

affect the overall product functionality.

 

 

 

 

ODT

On-Die Termination

 

 

 

 

OLTM

Open Loop Thermal Management

 

 

 

 

PCG

Platform Compatibility Guide (PCG) (previously known as FMB) provides a design

 

target for meeting all planned processor frequency requirements.

 

 

 

 

 

 

 

Platform Controller Hub. The chipset with centralized platform capabilities including

 

PCH

the main I/O interfaces along with display connectivity, audio features, power

 

 

management, manageability, security, and storage features.

 

 

 

 

 

The Platform Environment Control Interface (PECI) is a one-wire interface that

 

PECI

provides a communication channel between Intel processor and chipset components

 

 

to external monitoring devices.

 

 

 

 

 

Case-to-ambient thermal characterization parameter (psi). A measure of thermal

 

Ψ ca

solution performance using total package power. Defined as (TCASE - TLA ) / Total

 

 

Package Power. The heat source should always be specified for Y measurements.

 

 

 

 

 

PCI Express* Graphics. External Graphics using PCI Express* Architecture. It is a

 

PEG

high-speed serial interface where configuration is software compatible with the

 

 

existing PCI specifications.

 

 

 

 

PL1, PL2

Power Limit 1 and Power Limit 2

 

 

 

 

PPD

Pre-charge Power-down

 

 

 

 

Processor

The 64-bit multi-core component (package)

 

 

 

 

 

The term “processor core” refers to Si die itself, which can contain multiple execution

 

Processor Core

cores. Each execution core has an instruction cache, data cache, and 256-KB L2

 

 

cache. All execution cores share the L3 cache.

 

 

 

 

Processor Graphics

Intel Processor Graphics

 

 

 

 

Rank

A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC.

 

 

 

 

SCI

System Control Interrupt. SCI is used in the ACPI protocol.

 

 

 

 

SF

Strips and Fans

 

 

 

 

SMM

System Management Mode

 

 

 

 

SMX

Safer Mode Extensions

 

 

 

 

 

A non-operational state. The processor may be installed in a platform, in a tray, or

 

 

loose. Processors may be sealed in packaging or exposed to free air. Under these

 

 

conditions, processor landings should not be connected to any supply voltages, have

 

Storage Conditions

any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed

 

 

packaging or a device removed from packaging material), the processor must be

 

 

handled in accordance with moisture sensitivity labeling (MSL) as indicated on the

 

 

packaging material.

 

 

 

 

SVID

Serial Voltage Identification

 

 

 

 

TAC

Thermal Averaging Constant

 

 

 

 

TAP

Test Access Point

 

 

 

 

TCASE

The case temperature of the processor, measured at the geometric center of the top-

 

side of the TTV IHS.

 

 

 

 

 

 

TCC

Thermal Control Circuit

 

 

 

 

 

continued...

Intel® Xeon® Processor E3-1200 v3 Product Family

Datasheet – Volume 1 of 2

June 2013

14

 

Order No.: 328907-001