Electrical Specifications—Processor

Symbol

Parameter

Min

Typ

Max

Unit

Note1

PMAX

2013D PCG

—

—

153

W

9

 

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013C PCG

—

—

121

W

9

 

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013B PCG

—

—

99

W

9

 

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

PMAX

2013A PCG

—

—

83

W

9

 

PMAX

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.

2.Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. This differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).

3.The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 20-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

4.ICC_MAX specification is based on the VCC loadline at worst case (highest) tolerance and ripple.

5.The VCC specifications represent static and transient limits.

6.The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and VSS_SENSE lands.

7.PSx refers to the voltage regulator power state as set by the SVID protocol.

8.PCG is Platform Compatibility Guide (previously known as FMB). These guidelines are for estimation purposes only.

9.PMAX is the maximum power the processor will dissipate as measured at VCC_SENSE and

VSS_SENSE lands. The processor may draw this power for up to 10 ms before it regulates to PL2.

Table 41. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications

Symbol

Parameter

Min

Typ

Max

 

Unit

Note

 

 

 

 

 

 

 

 

 

VDDQ (DC+AC)

Processor I/O supply

 

 

 

 

 

 

voltage for DDR3/DDR3L

Typ-5%

1.5

Typ+5%

 

V

2, 3, 5

DDR3/DDR3L

 

(DC + AC specification)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDDQ (DC+AC)

Processor I/O supply

 

 

 

 

 

 

voltage for DDR3L (DC +

Typ-5%

1.35

Typ+5%

 

V

2, 3, 6

DDR3/DDR3L

 

AC specification)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IccMAX_VDDQ (DDR3/

Max Current for VDDQ Rail

—

—

2.5

 

A

 

DDR3L)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICCAVG_VDDQ (Standby)

Average Current for VDDQ

—

12

20

 

mA

4

Rail during Standby

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1.

The current supplied to the DIMM modules is not included in this specification.

 

 

2.

Includes AC and DC error, where the AC noise is bandwidth limited to under 20 MHz.

 

3.

No requirement on the breakdown of AC versus DC noise.

 

 

 

 

4.

Measured at 50 °C

 

 

 

 

 

 

5.

This specification applies to UP Server/Workstation processors paired with a PCH configured with

 

Intel AMT FW

 

 

 

 

 

 

6.

This specification applies to UP Server/workstation processors paired with a PCH configured with

 

SPS FW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Intel® Xeon® Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

95