Thermal Management—Processor

 

 

 

 

 

TLA,

Maximum

TCASE-MAX

@

Processor

PCG2

Package

Platform

Heatsink5

Airflow,

TCASE

Platform

 

 

TDP3

TDP4

 

RPM,

Thermal

TDP8

 

 

 

 

 

 

ѰCA6

Profile7

 

 

 

 

 

 

 

 

2C/GT2 35 W1

 

 

 

Active Short

45.4 °C,

y = 0.51 *

66.3 °C

 

 

35 W

35 W

3000 RPM,

Power + 48.5

 

 

 

(DHA-D)

 

 

 

 

 

 

0.597 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT0 25 W1

 

 

 

ATCA

67 °C,

y = 0.48 *

81.1 °C

 

2013A

25 W

25 W

Reference

10 CFM,

Power + 69.1

 

 

 

 

 

 

Heatsink9

0.565 °C/W

 

 

 

2C/GT0 16 W1

 

 

 

ATCA

67 °C,

y = 0.48 *

75.8 °C

 

 

16 W

16 W

Reference

10 CFM,

Power + 68.2

 

 

 

 

 

 

Heatsink9

0.565 °C/W

 

 

 

Notes: 1. TDP shown here, 95 W for example, represents the maximum expected platform TDP in the next generation platform for this type of SKU. This placeholder value is provided as a guideline for hardware design for the next generation platform.

2.Platform Compatibility Guide (PCG) provides a design target for meeting all planned processor frequency requirements. For more information, refer to Voltage and Current Specifications on page 94.

3.Package Thermal Design Power (TDP) is for the Intel® Xeon® processor E3-1200 v3 Product Family.

4.Platform Thermal Design Power (TDP) includes projections for the refresh processor that follow the Intel® Xeon® processor E3-1200 v3 Product Family in this platform.

5.Thermal Solution information can be found in the following table.

6.These boundary conditions and performance targets are used to generate processor thermal specifications and to provide guidance for heatsink design. Values are for the heatsink shown in the adjacent column are calculated at sea

level, and are expected to meet the Thermal Profile at TDP. TLA is the local ambient temperature of the heatsink inlet air. Airflow is through the heatsink fins with zero bypass for a passive heatsink. RPM is fan revolutions per

minute for an active heatsink. ѰCA is the maximum target (mean + 3 sigma) for the thermal characterization parameter. For more information on the thermal characterization parameter, refer to the processor Thermal Mechanical Design Guidelines (see Related Documents section).

7.Maximum TCASE Thermal Profile is the specification that must be complied to. Any Attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other system components.

8.TCASE-MAXat Platform TDP is calculated using the maximum TCASE Thermal Profile and the platform TDP.

9.ATCA Reference Heatsink supports Socket B and is not tooled for Socket H.

5.5Processor Temperature

A software readable field in the TEMPERATURE_TARGET register that contains the minimum temperature at which the TCC will be activated and PROCHOT# will be asserted. The TCC activation temperature is calibrated on a part-by-part basis and normal factory variation may result in the actual TCC activation temperature being higher than the value listed in the register. TCC activation temperatures may change based on processor stepping, frequency or manufacturing efficiencies.

5.6Adaptive Thermal Monitor

The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce processor power using a combination of methods. The first method (Frequency control, similar to Thermal Monitor 2 (TM2) in previous generation processors) involves the processor reducing its operating frequency (using the core ratio multiplier) and internal core voltage. This combination of lower frequency and core voltage results in a reduction of the processor power consumption. The second method (clock modulation, known as Thermal Monitor 1 or TM1 in previous generation processors) reduces power consumption by modulating (starting and stopping) the internal processor core clocks. The processor intelligently selects the appropriate TCC

 

Intel® Xeon® Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

69