Processor—Thermal Management

Performance Targets

The following table provides boundary conditions and performance targets as guidance for thermal solution design. Thermal solutions must be able to comply with the Maximum TCASE Thermal Profile.

Table 20.

Boundary Conditions, Performance Targets, and TCASE Specifications

 

 

 

 

 

 

TLA,

Maximum

TCASE-MAX

@

Processor

PCG2

Package

Platform

Heatsink5

Airflow,

TCASE

Platform

 

 

TDP3

TDP4

 

RPM,

Thermal

TDP8

 

 

 

 

 

 

ѰCA6

Profile7

 

 

 

 

 

 

 

 

4C/GT2 95 W1

 

 

 

Active Cu

40 °C,

y = 0.33 *

73.7 °C

 

 

84 W

87 W

3100 RPM,

Power + 45.0

 

 

Workstation

 

Core (DHA-A)

 

 

 

 

 

0.383 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT2 95 W1

 

 

 

1U Al

40 °C,

 

73.7 °C

 

 

84 W

87 W

11.5 CFM,

 

 

 

 

Heatpipe

 

 

 

 

 

 

 

0.383 °C/W

 

 

 

 

2013D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT0 95 W1

 

 

1U Al

42 °C,

y = 0.33 *

73.6 °C

 

 

 

 

 

 

80 W

82 W

11.5 CFM,

Power + 46.6

 

 

 

Heatpipe

 

 

 

 

 

 

0.383 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT0 80 W1

 

 

 

1U Al

42 °C,

 

73.0 °C

 

 

80 W

80 W

11.5 CFM,

 

 

 

 

Heatpipe

 

 

 

 

 

 

 

0.383 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT2 65 W1

 

 

 

Active Al

40 °C,

y = 0.41 *

71.3 °C

 

2013C

65 W

65 W

3100 RPM,

Power + 44.7

 

 

Core (DHA-B)

 

 

 

 

 

 

0.487 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4C/GT1 45 W1

 

 

 

Active Short

44.5 °C,

y = 0.51 *

71.4 °C

 

2013B

45 W

45 W

3000 RPM,

Power + 48.5

 

 

(DHA-D)

 

 

 

 

 

 

0.597 °C/W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

continued...

Intel® Xeon® Processor E3-1200 v3 Product Family

 

Datasheet – Volume 1 of 2

June 2013

68

Order No.: 328907-001