Package Mechanical Specifications—Processor

Parameter

Description

Minimum

Maximum

Notes

 

 

 

 

 

RHsustained storage

The maximum device storage relative

60% @ 24 °C

5, 6

humidity for a sustained period of time.

 

 

 

 

 

 

 

 

 

 

A prolonged or extended period of time;

 

 

 

TIMEsustained storage

typically associated with customer shelf

0 Months

6 Months

6

 

life.

 

 

 

 

 

 

 

 

Notes: 1. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2.Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard. Non-adherence may affect processor reliability.

3.TABSOLUTE storage applies to the unassembled component only and does not apply to the shipping media, moisture barrier bags, or desiccant.

4.Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

5.The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6.Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by Tsustained storage and customer shelf life in applicable intel box and bags.

 

Intel® Xeon® Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

105