Intel BX80646E31230V3, BX80646E31240V3 1.4Thermal Management Support, 1.5Package Support, 1.6Terminology

Processor—Introduction

1.4Thermal Management Support

•Digital Thermal Sensor

•Adaptive Thermal Monitor

•THERMTRIP# and PROCHOT# support

•On-Demand Mode

•Memory Open and Closed Loop Throttling

•Memory Thermal Throttling

•External Thermal Sensor (TS-on-DIMM and TS-on-Board)

•Render Thermal Throttling

•Fan speed control with DTS

1.5Package Support

The processor socket type is noted as LGA 1150. The package is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA 1150). See the appropriate Processor Thermal Mechanical Design Guidelines and LGA1150 Socket Application Guide for complete details on the package.

1.6Terminology

Table 1.	Terminology
	Term	Description
	APD	Active Power-down
	B/D/F	Bus/Device/Function
	BGA	Ball Grid Array
	BLC	Backlight Compensation
	BLT	Block Level Transfer
	BPP	Bits per pixel
	CKE	Clock Enable
	CLTM	Closed Loop Thermal Management
	DDI	Digital Display Interface
	DDR3	Third-generation Double Data Rate SDRAM memory technology
	DLL	Delay-Locked Loop
	DMA	Direct Memory Access
	DP	DisplayPort*
	DTS	Digital Thermal Sensor
	EC	Embedded Controller
	ECC	Error Correction Code

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Intel® Xeon® Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2	June 2013
12	Order No.: 328907-001