Intel BX80646E31230V3, BX80646E31240V3 Figures

Contents—Processor

6.14 Processor Internal Pull-Up /Pull-Down Terminations................................................		85
7.0 Electrical Specifications..............................................................................................		86
7.1	Integrated Voltage Regulator..................................................................................	86
7.2	Power and Ground Lands ......................................................................................	86
7.3	V CC Voltage Identification (VID)..............................................................................	86
7.4	Reserved or Unused Signals...................................................................................	91
7.5	Signal Groups.......................................................................................................	91
7.6	Test Access Port (TAP) Connection..........................................................................	93
7.7	DC Specifications.................................................................................................	93
7.8	Voltage and Current Specifications..........................................................................	94
	7.8.1 PECI DC Characteristics.............................................................................	99
	7.8.2 Input Device Hysteresis...........................................................................	100
8.0 Package Mechanical Specifications...........................................................................		101
8.1	Processor Component Keep-Out Zone....................................................................	101
8.2	Package Loading Specifications.............................................................................	101
8.3	Package Handling Guidelines................................................................................	102
8.4	Package Insertion Specifications............................................................................	102
8.5	Processor Mass Specification.................................................................................	102
8.6	Processor Materials.............................................................................................	102
8.7	Processor Markings.............................................................................................	103
8.8	Processor Land Coordinates..................................................................................	103
8.9	Processor Storage Specifications...........................................................................	104
9.0 Processor Ball and Signal Information......................................................................		106

Figures

1	Platform Block Diagram ...........................................................................................	10
2	Intel ® Flex Memory Technology Operations.................................................................	20
3	PCI Express* Related Register Structures in the Processor............................................	24
4	PCI Express* Typical Operation 16 Lanes Mapping.......................................................	25
5	Processor Graphics Controller Unit Block Diagram........................................................	28
6	Processor Display Architecture...................................................................................	31
7	DisplayPort* Overview.............................................................................................	32
8	HDMI* Overview.....................................................................................................	33
9	Example for PECI Host-Clients Connection..................................................................	37
10	Device to Domain Mapping Structures........................................................................	41
11	Processor Power States............................................................................................	48
12	Idle Power Management Breakdown of the Processor Cores ..........................................	51
13	Thread and Core C-State Entry and Exit......................................................................	52
14	Package C-State Entry and Exit.................................................................................	56
15	Thermal Test Vehicle (TTV) Case Temperature (T CASE ) Measurement Location..................	64
16	Digital Thermal Sensor (DTS) 1.1 Definition Points.......................................................	65
17	Digital Thermal Sensor (DTS) Thermal Profile Definition................................................	67
18	Package Power Control.............................................................................................	75
19	Input Device Hysteresis..........................................................................................	100
20	Processor Package Assembly Sketch.........................................................................	101
21	Processor Top-Side Markings...................................................................................	103
22	Processor Package Land Coordinates........................................................................	104

	Intel® Xeon® Processor E3-1200 v3 Product Family
June 2013	Datasheet – Volume 1 of 2
Order No.: 328907-001	5