Intel® IXF1104 4-Port Gigabit Ethernet Media Access Controller
Datasheet 224
Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005
9.0 Mechanical Specifications
The IXF1104 MAC is packaged in a 576-ball BGA package with 6 balls removed di agonally from
each corner, for a total of 552 balls used measuring 25 mm x 25 mm. The pitch of th e package ba lls
is 1 mm.
9.1 Overview
CBGA (standard and RoHS-compliant) and FC-PBGA packages are suited for applications
requiring high I/O counts and high electrical performance, and are recommended for high-power
applications with high noise immunity requirements.
Note: The FC-PBGA package will not be available until mid-2006. Please see your field sal es
representative for more detailed information.
9.1.1 Features
•Flip chip die attach; surface mount second-level interconnect
•High electrical performan c e
•High I/O counts
•Area array I/O options
•Multiple power-zone offering supports core and four additional voltages
•JEDEC-compliant package
9.2 Package Specifics
The IXF1104 MAC uses the following package:
•576-ball BGA package with 6 balls removed diagonally from each corner, for a total of 552
balls used
•Ball pitch of 1.0 mm
•Overall package dimensions of 25 mm x 25 mm