Intel IXF1104 - page 227

Intel® IXF1104 4-Port Gigabit Ethernet Media Access Controller
227 Datasheet
Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005
9.3.2 Flip Chip-Plastic Ball Grid Array Package Diagram
Figure 57 illustrates the FC-PBGA top and bottom package views and Figure 58 lists the FC-
PBGA mechanical spe cifications.
Note: Please contact your field sales representative for more information on the FC-PBGA package.
Figure 57. FC-PBGA Package (Top and Bottom Views)
B5181-02
Basic
1.00 mm
Basic
1.00 mm
łeee (0.25)
łb
(0.55 min
0.75 max)
01
Terminal A01
Identifier
Lid
Seating Plane
Substrate
ABC
02
03
CA
MB
łfff (0.10) C
M
e
A
E
D
e
= No Ball
= Ball
Notes:
All dimensions are in millimeters.
Legend:
TOP VIEW
BOTTOM VIEW
C
aaa (0.20)
ccc (0.35)// C
A (3.27 max)
A1
(0.40 min)
bbb (0.25)// C
25.0 Nom – 0.2
25.0 Nom – 0.2
All around
ddd (0.20)
B