Texas Instruments MSP430 B.25 MSP-TS430PZ100USB

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MSP-TS430PZ100USB

Table B-25. MSP-TS430PZ5x100 Bill of Materials

No.per

Pos. RefDes Description DigiKeyPart No. Comment

Board

1 C1,C2 0 12pF,SMD0805 DNP

DNP:Only

1b C3,C4 47pF,SMD0805 recommendation. Check

yourcrystal spec.

2 C6,C7 2 10uF/10V,Tantal Size B 511-1463-2-ND

C5,C10,

C11,

3 4 100nF,SMD0805 311-1245-2-ND DNP: C12, C14

C12,C13,

C14

4 C8 0 2.2nF,SMD0805 DNP

5 C9 1 470nF,SMD0805 478-1403-2-ND

6 D1 1 greenLED, SMD0805 67-1553-1-ND

DNP:headers and

receptaclesenclosed with

J1,J2, J3, "SAM1029-25-

7 0 25-pinheader, TH kit.Keep vias free of

J4 NDSAM1213-25-ND" solder.:Header:

Receptacle

8 J5 1 3-pinheader, male, TH SAM1035-03-ND

JP5,JP6,

JP7,

9 6 3-pin header, male, TH SAM1035-03-ND Placejumpers on pins 2-3

JP8,JP9,

JP10

10 JP1,JP2 2 2-pin header, male, TH SAM1035-02-ND Placejumper on header

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Placejumper on pins 1-2

Placeon JP1, JP2, JP3,

12 9 Jumper 15-38-1024-ND JP5,JP6, JP7, JP8, JP9,

JP10

13 JTAG 1 14-pin connector, male, TH HRP14H-ND

DNP:Keep vias free of

14 BOOTST 0 10-pin connector, male, TH solder

Q1:Micro Crystal DNP: Keep vias free of

15 Q1,Q2 0 Crystal MS1V-T1K 32.768kHz, solder

C(Load)= 12.5pF

16 R3, R7 2 330Ω, SMD0805 541-330ATR-ND

R1,R2, R4,

R6,R8, R9, DNP:R6, R8, R9, R10,

17 3 0Ω, SMD0805 541-000ATR-ND

R10,R11, R11,R12

R12

18 R5 1 47kΩ, SMD0805 541-47000ATR-ND

19 U1 1 Socket:IC357-1004-53N Manuf.:Yamaichi

20 PCB 1 90 x 82 mm 2layers

Rubber Applyto corners at bottom

21 4 Selectappropriate

standoff side

DNP:Enclosed with kit

22 MSP430 2 MSP430F5438IPZ suppliedby TI

B.25 MSP-TS430PZ100USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately

0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for

example, to run the MCU at 3.0 V, set it to 3.3 V.

107

SLAU278F–May 2009 –Revised December 2010 Hardware