Texas Instruments manual Table B-10. MSP-TS430QFN23x0 Bill of Materials, MSP430F2370IRHA

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Table B-10. MSP-TS430QFN23x0 Bill of Materials

Pos.	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP
2	C3	1	10uF/10V, Tantal Size B	511-1463-2-ND
3	C4	1	100nF, SMD0805	478-3351-2-ND
4	C5	1	10nF, SMD0805	478-1383-2-ND
5	D1	1	green LED, SMD0603	475-1056-2-ND
					DNP: headers and
	J1, J2, J3,			SAM1034-10-NDSAM1212-	receptacles enclosed with
6		0	10-pin header, TH		kit.Keep vias free of
	J4			10-ND	solder.: Header:
					Receptacle
7	J5, JP1	2	3-pin header, male, TH	SAM1035-03-ND	Place jumper on header
					JP1; Pos 1-2.
8	JP2, JP3	2	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
9		3	Jumper	15-38-1024-ND	Place on: JP1, JP2, JP3
10	JTAG	1	14-pin connector, male, TH	HRP14H-ND
11	BOOTST	0	10-pin connector, male, TH		DNP: Keep vias free of
					solder
				Micro Crystal MS1V-T1K	DNP: Keep vias free of
12	Q1	0	Crystal	32.768kHz, C(Load) =
					solder
				12.5pF
13	R1	1	330 Ω, SMD0805	541-330ATR-ND
14	R2, R3	0	0 Ω, SMD0805	541-000ATR-ND	DNP
15	R4	1	47k Ω, SMD0805	541-47000ATR-ND
16	U1	1	Socket: QFN-40B-0.5-01		Manuf.: Enplas
17	PCB	1	79 x 66 mm		2 layers
18	Adhesive	4	~6mm width, 2mm height	e.g., 3M Bumpons Part No.	Apply to corners at bottom
	Plastic feet			SJ-5302	side
19	MSP430	2	MSP430F2370IRHA		DNP: enclosed with kit
					supplied by TI

60	Hardware	SLAU278F –May 2009 –Revised December 2010
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