MSP-TS430QFN23x0

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Table B-10. MSP-TS430QFN23x0 Bill of Materials
No.per
Pos. RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP
2 C3 1 10uF/10V,Tantal Size B 511-1463-2-ND
3 C4 1 100nF,SMD0805 478-3351-2-ND
4 C5 1 10nF,SMD0805 478-1383-2-ND
5 D1 1 greenLED, SMD0603 475-1056-2-ND
DNP:headers and
receptaclesenclosed with
J1,J2, J3, SAM1034-10-NDSAM1212-
6 0 10-pinheader, TH kit.Keepvias free of
J4 10-ND solder.:Header:
Receptacle
Placejumper on header
7 J5,JP1 2 3-pinheader, male, TH SAM1035-03-ND JP1;Pos 1-2.
8 JP2,JP3 2 2-pin header, male, TH SAM1035-02-ND Placejumper on header
9 3 Jumper 15-38-1024-ND Placeon: JP1, JP2, JP3
10 JTAG 1 14-pinconnector, male, TH HRP14H-ND
DNP:Keep vias free of
11 BOOTST 0 10-pin connector, male, TH solder
MicroCrystal MS1V-T1K DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz,C(Load) = solder
12.5pF
13 R1 1 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3 0 0Ω, SMD0805 541-000ATR-ND DNP
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: QFN-40B-0.5-01 Manuf.:Enplas
17 PCB 1 79 x 66 mm 2layers
Adhesive e.g.,3M Bumpons Part No. Apply to corners at bottom
18 4 ~6mmwidth, 2mm height
Plasticfeet SJ-5302 side
DNP:enclosed with kit
19 MSP430 2 MSP430F2370IRHA suppliedby TI
60 Hardware SLAU278F–May 2009 –Revised December 2010
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