www.ti.comMSP-TS430PN80USB

Table B-20. MSP-TS430PN80A Bill of Materials

Position

Ref Des

No. per

Description

DigiKey Part No.

Comment

Board

 

 

 

 

 

 

 

 

 

 

 

1

C1, C2

0

12pF, SMD0805

 

DNP

 

 

 

 

 

 

2

C3, C4

0

47pF, SMD0805

 

DNP

 

 

 

 

 

 

3

C6, C7,

3

10uF/6.3V, SMD0805

 

DNP C10

C10, C12

 

 

 

 

 

 

 

 

 

 

 

 

 

C5, C11,

 

 

 

 

4

C13, C14,

5

100nF, SMD0805

311-1245-2-ND

 

 

C15

 

 

 

 

 

 

 

 

 

 

5

C8

1

2.2nF, SMD0805

 

 

 

 

 

 

 

 

6

C9

1

470nF, SMD0805

478-1403-2-ND

 

 

 

 

 

 

 

7

C16

1

4.7uF, SMD0805

 

 

 

 

 

 

 

 

8

C17

1

220nF, SMD0805

 

 

 

 

 

 

 

 

9

D1

1

green LED, SMD0805

P516TR-ND

 

 

 

 

 

 

 

 

 

 

 

SAM1029-20-ND

DNP: Headers and receptacles

 

J1, J2, J3,

 

 

(Header)

10

0

20-pin header, TH

enclosed with kit. Keep vias free of

J4

SAM1213-20-ND

 

 

 

solder:

 

 

 

 

(Receptacle)

 

 

 

 

 

 

 

 

 

 

 

11

J5 , J6

2

3-pin header, male, TH

 

 

 

 

 

 

 

 

 

JP3, JP5,

 

 

 

place jumpers on pins 2-3 on JP5,

 

JP6, JP7,

 

 

 

12

7

3-pin header, male, TH

SAM1035-03-ND

JP6, JP7, JP8, JP9, JP10 place

JP8, JP9,

 

 

 

 

jumpers on pins 1-2 on JP3,

 

JP10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

13

JP1, JP2,

3

2-pin header, male, TH

SAM1035-02-ND

Place jumper on header

JP4

 

 

 

 

 

 

 

 

 

 

 

14

 

10

Jumper

15-38-1024-ND

See Pos. 12 and Pos. 13

 

 

 

 

 

 

15

JTAG

1

14-pin connector, male,

HRP14H-ND

 

TH

 

 

 

 

 

 

 

 

 

 

 

 

16

BOOTST

0

10-pin connector, male,

 

"DNP Keep vias free of solder"

TH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Micro Crystal MS3V-T1R

 

17

Q1

0

Crystal

32.768kHz, C(Load) =

DNP: Q1 Keep vias free of solder

 

 

 

 

12.5pF

 

 

 

 

 

 

 

18

Q2

0

Crystal

Q2: 4MHz Buerklin:

DNP: Q2 Keep vias free of solder

78D134

 

 

 

 

 

 

 

 

 

 

 

 

Insulating

 

 

http://www.ettinger.de/Ar

 

19

0

Insulating disk to Q2

t_Detail.cfm?ART_ART

 

disk to Q2

 

 

 

 

NUM=70.08.121

 

 

 

 

 

 

 

 

 

 

 

 

20

D3,D4

2

LL103A

Buerklin: 24S3406

 

 

 

 

 

 

 

21

R3, R7

2

330 Ω, SMD0805

541-330ATR-ND

 

 

 

 

 

 

 

 

R1, R2,

 

 

 

 

 

R4, R6,

 

 

 

 

22

R8,

3

0 Ohm, SMD0805

541-000ATR-ND

DNP: R6, R8, R9, R10, R11,R12

 

R9,R10,

 

 

 

 

 

R11, R12

 

 

 

 

 

 

 

 

 

 

23

R5

1

47k Ω, SMD0805

541-47000ATR-ND

 

 

 

 

 

 

 

24

U1

1

Socket:IC201-0804-014

 

Manuf.: Yamaichi

 

 

 

 

 

 

25

PCB

1

77 x 91 mm

 

2 layers

 

 

 

 

 

 

26

Adhesive

4

about 6mm width, 2mm

e.g., 3M Bumpons Part

Apply to corners at bottom side

plastic feet

height

No. SJ-5302

 

 

 

 

 

 

 

 

 

27

MSP430

2

MSP430F5329IPN

 

DNP: enclosed with kit, supplied by TI

 

 

 

 

 

 

B.20 MSP-TS430PN80USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately

0.3V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, to run the MCU at 3.0 V, set it to 3.3 V.

SLAU278F –May 2009 –Revised December 2010

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Texas Instruments MSP430 manual Table B-20. MSP-TS430PN80A Bill of Materials, DNP C10