Texas Instruments MSP430 Table B-5. MSP-TS430PW24 Bill of Materials

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Table B-5. MSP-TS430PW24 Bill of Materials

No.per

Position RefDes Description DigiKeyPart No. Comment

Board

1 C1,C2 0 12pF,SMD0805 DNP

2 C5 1 2.2nF,SMD0805

3 C3,C7 2 10uF/10V,SMD0805

4 C4,C6, C8 3 100nF, SMD0805 478-3351-2-ND

5 D1 1 greenLED, SMD0805 P516TR-ND

DNP:Headers and receptacles

"SAM1029-07-

6 J1, J2 0 12-pin header, TH enclosedwith kit. Keep vias free of

NDSAM1213-07-ND" solder.(Header & Receptacle)

J5,JP1,

JP4,JP5, Placejumper on 1-2 of JP4-JP9

7 8 3-pin header, male, TH SAM1035-03-ND

JP6,JP7, Placeon 1-2 on JP1

JP8,JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND seePos 7 an 8

14-pinconnector, male,

10 JTAG 1 HRP14H-ND

11 Q1 0 Crystal DNP:keep vias free of solder

12 R1,R7 2 330Ω, SMD0805 541-330ATR-ND

R5,R6,

13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6

R8,R9,

14 R4 1 47kOhm, SMD0805 541-47000ATR-ND

Socket:OTS

15 U1 1 Manuf.:Enplas

24(28)-065-02-00

16 PCB 1 68.5 x 61 mm 2layers

Adhesive about6mm width, 2mm e.g.,3M Bumpons Part

17 4 Applyto corners at bottom side

plasticfeet height No. SJ-5302

18 MSP430 2 MSP430AFE2xx DNP:enclosedwith kit, supplied by TI

SLAU278F–May 2009 –Revised December 2010 Hardware