Texas Instruments MSP430 Table B-11. MSP-TS430RSB40 Bill of Materials

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MSP-TS430RSB40

Table B-11. MSP-TS430RSB40 Bill of Materials

No.Per

Pos. RefDes Description DigiKeyPart No. Comment

Board

1 C1,C2 0 12pF,SMD0805 DNP:C1, C2

C3,C7, C10,

2 3 10uF/10V,SMD 0805 445-1371-1-ND DNPC12

C12

C4,C6, C8,

3 3 100nF,SMD0805 311-1245-2-ND DNP C11

C11

4 C5 1 2.2nF, SMD0805

5 C9 1 470nF,SMD0805

6 D1 1 greenLED, SMD0805 P516TR-ND

DNP:headers and

receptaclesenclosed with kit.

7 J1,J2, J3, J4 4 10-pinheader, TH Keepvias free of solder. :

Header: Receptacle

DNP:headers and

receptaclesenclosed with kit.

7.1 4 10-pin header, TH Keepvias free of solder. :

Header: Receptacle

JP1,

JP4,JP5, Jumper:1-2 on JP1, JP10;

8 JP6,JP7, 9 3-pin header, male, TH SAM1035-03-ND 2-3on JP4-JP9

JP8,JP9, J5,

JP10

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

10 JTAG 1 14-pinconnector, male, TH HRP14H-ND

DNP.Keep vias free of

11 BOOTST 0 10-pinconnector, male, TH solder

QFN-40B-0.4_

12 U1 1 Enplas

ENPLAS_SOCKET

MicroCrystal MS3V-T1R DNP: Q1. Keep vias free of

13 Q1 0 Crystal 32.768kHz, C(Load) = solder

12.5pF

Placeon: JP1, JP2, JP3,

15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

JP9,JP10

16 R1,R7 2 330RSMD0805

R2,R3, R5,

17 R6, R8, R9, 3 0R SMD0805 DNPR2, R3, R5, R6

R10

18 R4 1 47kSMD0805

DNP:enclosed with kit. Is

19 MSP430 2 MSP430F5132 supplied by TI

Rubberstand selectappropriate; e.g., applyto corners at bottom

20 4

off Buerklin:20H1724 side

SLAU278F–May 2009 –Revised December 2010 Hardware