Texas Instruments MSP430 manual Table B-1. MSP-TS430PW14 Bill of Materials

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Table B-1. MSP-TS430PW14 Bill of Materials

Position	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP
2	C7	1	10uF/10V, Tantal Size B	511-1463-2-ND
3	C3, C5	1	100nF, SMD0805	478-3351-2-ND	DNP: C3
4	C8	0	2.2nF, SMD0805		DNP
5	D1	1	green LED, SMD0603	475-1056-2-ND
				"SAM1029-07-	DNP: Headers and receptacles
6	J1, J2	0	7-pin header, TH		enclosed with kit. Keep vias free of
				NDSAM1213-07-ND"
					solder: Header: Receptacle
	J3, J5, J7,				Place jumpers on headers J5, J7, J8,
7	J8, J9, J10,	8	3-pin header, male, TH	SAM1035-03-ND
					J9, J10, J11, J12; Pos 1-2
	J11, J12
8	J4, J6	2	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
9		9	Jumper	15-38-1024-ND	Place on: J5, J7-J12; Pos 1-2
10	JTAG	1	14-pin connector, male,	HRP14H-ND
			TH
				Micro Crystal MS1V-T1K
12	Q1	0	Crystal	32.768kHz, C(Load) =	DNP: keep vias free of solder
				12.5pF
13	R2, R3	2	330 Ω, SMD0805	541-330ATR-ND
15	R5	1	47k Ω, SMD0805	541-47000ATR-ND
16	U1	1	Socket: OTS-14-0.65-01		Manuf.: Enplas
17	PCB	1	56 x 53 mm		2 layers
18	Adhesive	4	about 6mm width, 2mm	e.g., 3M Bumpons Part	Apply to corners at bottom side
	plastic feet		height	No. SJ-5302
19	MSP430	2	MSP430F2013IPW		DNP: enclosed with kit, supplied by TI

36	Hardware	SLAU278F –May 2009 –Revised December 2010
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