MSP-TS430PW14

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Table B-1. MSP-TS430PW14 Bill of Materials
No.per
Position RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP
2 C7 1 10uF/10V,Tantal Size B 511-1463-2-ND
3 C3,C5 1 100nF,SMD0805 478-3351-2-ND DNP:C3
4 C8 0 2.2nF,SMD0805 DNP
5 D1 1 greenLED, SMD0603 475-1056-2-ND
DNP:Headers and receptacles
"SAM1029-07-
6 J1, J2 0 7-pin header, TH enclosedwith kit. Keep vias free of
NDSAM1213-07-ND" solder:Header: Receptacle
J3,J5, J7, Placejumpers on headers J5, J7, J8,
7 J8, J9, J10, 8 3-pinheader,male, TH SAM1035-03-ND J9,J10, J11, J12; Pos 1-2
J11,J12
8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Placejumper on header
9 9 Jumper 15-38-1024-ND Placeon: J5, J7-J12; Pos 1-2
14-pinconnector, male,
10 JTAG 1 HRP14H-ND
TH
MicroCrystal MS1V-T1K
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF
13 R2,R3 2 330Ω, SMD0805 541-330ATR-ND
15 R5 1 47kΩ, SMD0805 541-47000ATR-ND
16 U1 1 Socket:OTS-14-0.65-01 Manuf.:Enplas
17 PCB 1 56 x 53 mm 2layers
Adhesive about6mm width, 2mm e.g.,3M Bumpons Part
18 4 Applyto corners at bottom side
plasticfeet height No. SJ-5302
19 MSP430 2 MSP430F2013IPW DNP:enclosed with kit, supplied by TI
36 Hardware SLAU278F–May 2009 –Revised December 2010
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