Texas Instruments MSP430 Table B-7. MSP-TS430PW28 Bill of Materials

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Table B-7. MSP-TS430PW28 Bill of Materials(1)

No.per

Pos. RefDes Description DigiKeyPart No. Comment

Board

DNP:C1, C2 , Cover holes

1 C1,C2 0 12pF,SMD0805 whilesoldering

2 C3 1 10uF/10VTantal Elko B

3 C4 1 100nF,SMD0805

4 C5 0 2.2nF,SMD0805 DNP

5 D1 1 LEDgreen SMD0603

MicroCrystal MS1V-T1K DNP:Cover holes and

6 Q1 0 QUARZ,Crystal 32.768kHz,C(Load) = neighboringholes while

12.5pF soldering

DNP:Headers and

receptaclesenclosed with

7 J1, J2 2 14-pinheader, TH male kit.Keepvias free of

solder.:Header:

Receptacle

DNP:headers and

receptaclesenclosed with

7.1 2 14-pinheader, TH female kit.Keepvias free of

solder.:Header:

Receptacle

8 J5,IP1 1 3-PinConnector , male

JP1,JP4,

JP5,JP6,

8a 7 3-PinConnector , male Jumperon Pos 1-2

JP7,JP8,

JP9

9 JP2,JP3 2 2-PinConnector , male with Jumper

DNP:Cover holes while

10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering

11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121

12 R1, R7 2 330R,SMD0805

R2,R3, R5,

12 0 0R,SMD0805 DNP

14 R4 1 47K,SMD0805

15 U1 1 SOP28PWsocket Enplas: OTS-28-0.65-01

(1) PCB66 x 79 mm, two layers; Rubber stand off, four pieces

SLAU278F–May 2009 –Revised December 2010 Hardware