MSP-TS430RGZ48B

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Table B-14. MSP-TS430RGZ48B Bill of Materials
No.per
Position RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP
2 C3,C4 0 47pF,SMD0805 DNP
C6,C7,
3 3 10uF/6.3V,SMD0805
C12
C5,C11,
4 4 100nF,SMD0805 311-1245-2-ND
C13,C14
5 C8 1 2.2nF,SMD0805
6 C9 1 470nF,SMD0805 478-1403-2-ND
7 D1 1 greenLED, SMD0805 P516TR-ND
SAM1029-12-ND DNP:Headers and receptacles
J1,J2, J3, (Header)
8 0 12-pin header, TH enclosedwith kit. Keep vias free of
J4 SAM1213-12-ND solder:
(Receptacle)
9 J5 1 3-pin header,male, TH
JP3,JP5, placejumpers on pins 2-3 on JP5,
JP6,JP7,
10 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place
JP8,JP9, jumperson pins 1-2 on JP3,
JP10
11 JP1,JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
12 9 Jumper 15-38-1024-ND SeePos. 10and Pos. 11
14-pinconnector, male,
13 JTAG 1 HRP14H-ND
TH
10-pinconnector, male,
14 BOOTST 0 "DNPKeep vias free of solder"
TH
MicroCrystal MS3V-T1R
15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2:4MHz Buerklin:
16 Q2 0 Crystal DNP:Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Ar
Insulating
17 0 Insulating disk to Q2 t_Detail.cfm?ART_ART
diskto Q2 NUM=70.08.121
18 R3,R7 2 330Ω, SMD0805 541-330ATR-ND
R1,R2,
R4,R6,
19 R8, 3 0Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
R9,R10,
R11,R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket:
21 U1 1 QFN11T048- Manuf.:Yamaichi
008_A101121_RGZ48
22 PCB 1 81x 76 mm 2layers
Adhesive about6mm width, 2mm e.g., 3M Bumpons Part
23 4 Applyto corners at bottom side
plasticfeet height No. SJ-5302
24 MSP430 2 MSP430F5342IRGZ DNP:enclosed with kit, supplied by TI
72 Hardware SLAU278F–May 2009 –Revised December 2010
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