Table B-8. MSP-TS430PW28A Bill of Materials
Position | Ref Des | No. per | Description | DigiKey Part No. | Comment | |
Board | ||||||
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1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP | |
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2 | C5 | 1 | 2.2nF, SMD0805 |
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3 | C3 | 1 | 10uF/10V, SMD0805 |
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4 | C4, C6, | 2 | 100nF, SMD0805 |
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5 | D1 | 1 | green LED, SMD0805 |
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| DNP: Headers and receptacles | |
6 | J1, J2 | 0 |
| enclosed with kit. Keep vias free of | ||
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| solder: (Header & Receptacle) | |
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| J5, JP1, |
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7 | JP4, JP5, | 8 | Place jumper on | |||
JP6, JP7, | Place on | |||||
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| JP8, JP9 |
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8 | JP2, JP3 | 2 | Place jumper on header | |||
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9 |
| 9 | Jumper | see Pos 7 an 8 | ||
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10 | JTAG | 1 |
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TH |
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11 | BOOTST | 0 |
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| DNP Keep vias free of solder | |
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| Micro Crystal MS3V |
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12 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | DNP: keep vias free of solder | |
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| 12.5pF |
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13 | R1, R7 | 2 | 330 Ω, SMD0805 |
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14 | R2, R3,R5, | 0 | 0 Ohm, SMD0805 | DNP R2, R3,R5, R6 | ||
R6, | ||||||
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15 | R4 | 1 | 47k Ω, SMD0805 |
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16 | U1 | 1 | Socket: |
| Manuf.: Enplas | |
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17 | PCB | 1 | 63.5 x 64.8 mm |
| 2 layers | |
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18 | Adhesive | 4 | about 6mm width, 2mm | e.g., 3M Bumpons Part | Apply to corners at bottom side | |
plastic feet | height | No. | ||||
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19 | MSP430 | 2 | MSP430G2553IPW28 |
| DNP: enclosed with kit, supplied by TI | |
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54 | Hardware | SLAU278F |
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