MSP-TS430PN80USB
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Table B-21. MSP-TS430PN80USB Bill of Materials
No.per
Pos. RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP:C1, C2
1.1 C3,C4 2 47pF,SMD0805
2 C6,C7 2 10uF/6.3V,Tantal Size B 511-1463-2-ND
C5,C11,
3 4 100nF,SMD0805 311-1245-2-ND
C13,C14
3.1 C10, C12 0 10uF,SMD0805 311-1245-2-ND DNP:C10, C12
4 C8 1 2.2nF,SMD0805
5 C9 1 470nF,SMD0805 478-1403-2-ND
6 D1 1 greenLED, SMD0805 P516TR-ND
DNP:headers and
receptaclesenclosed with
J1,J2, J3,
7 4 20-pinheader, TH SAM1029-20-ND kit. Keep vias free of
J4 solder.:Header:
Receptacle
DNP:headers and
receptaclesenclosed with
7.1 4 20-pinheader, TH SAM1213-20-ND kit. Keep vias free of
solder.:Header:
Receptacle
8 J5 1 3-pinheader, male, TH SAM1035-03-ND
JP5,JP6,
JP7,
9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP8,JP9,
JP10
10 JP1,JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
Placejumper only on one
JP4 1 SAM1035-02-ND pin
11 JP3 1 3-pinheader, male, TH SAM1035-03-ND Place jumper on pins 1-2
Placeon: JP1, JP2, JP3,
12 10 Jumper 15-38-1024-ND JP4,JP5, JP6, JP7, JP8,
JP9,JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
MicroCrystal MS1V-T1K DNP:Q1 Keep vias free of
14 Q1 0 Crystal 32.768kHz,C(Load) = solder
12.5pF
"Q2:4MHzBuerklin:
15 Q2 1 Crystal 78D134"
16 R3, R7 2 330Ω, SMD0805 541-330ATR-ND
R1,R2, R4,
17 R6, R8, R9, 2 0Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 0 1M Ω, SMD0805 DNP
18 R5 1 47kΩ, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-0804-014 Manuf.:Yamaichi
20 PCB 1 79x 77 mm 2layers
Rubber Applyto corners at bottom
21 4 Buerklin: 20H1724
standoff side
DNP:Enclosed with kit
22 MSP430 2 MSP430F5529 suppliedby TI
http://www.ettinger.de/Art_
Insulating
23 1 Insulatingdisk to Q2 Detail.cfm?ART_ARTNUM
diskto Q2 =70.08.121
27 C33 1 220n Buerklin:53D2074
28 C35 1 10p Buerklin:56D102
94 Hardware SLAU278F–May 2009 –Revised December 2010
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