Texas Instruments MSP430 Table B-2. MSP-TS430L092 Bill of Materials

www.ti.com MSP-TS430L092
Table B-2. MSP-TS430L092 Bill of Materials
No.Per
Pos. RefDes No. Description DigiKeyPart No. Comment
Board
1 C1,C2 2 330nF, SMD0603
2 C5 1 100n, SMD0603
3 C6 1 10u, SMD0805
4 C10 1 100n, SMD0603
5 EEPROM1 1 M95512 SO08 (SO8) STMicro M95160R Digikey: 497-8688-1-ND
DNP:headers and
receptaclesenclosed with kit.
Keepvias free of solder.
7 J1,J2 2 7-pin header,TH SAM1213-07-ND : Header
SAM1035-07-ND : Receptacle
8 J3 1 3-pinheader, male, TH SAM1035-03-ND
DNP;Keep vias free of
9 J4,J5 2 FE4L, FE4H 4pol. Stiftreihe solder.
Reichelt:
11 J13 1 MICRO_STECKV_10 MicroMaTch-Connector:MM
FL10G
12 JP1, JP2,JP3 3 2-pinheader, male, TH SAM1035-02-ND placejumper on header
15 L1 1 33uH,SMD0806 LQH2MCN330K02L Farnell:151-5557
16 LED1,LED4 2 LEDCHIPLED_0603 Farnell:1686065
17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC
18 R0, R6, R7 3 2K7,SMD0603
19 R1 1 1k,SMD0603
20 R2 1 47k,SMD0603
R4,R5,R8,
21 6 10k, SMD0603
R10,RC, RD
22 RA 1 3.9k,SMD0603
23 RB 1 6.8k,SMD0603
14Pin Socket -
24 U1 1 Manuf.Yamaichi
IC189-0142-146
DNP:enclosed with kit. Is
22 MSP430 2 MSP430L092PWR suppliedby TI
39
SLAU278F–May 2009 –Revised December 2010 Hardware
SubmitDocumentation Feedback ©2009–2010, Texas Instruments Incorporated