MSP-TS430DW28

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Table B-6. MSP-TS430DW28 Bill of Materials
No.per
Position RefDes Description DigiKeyPart No. Comment
Board
DNP:C1, C2, Cover holes while
1 C1,C2 0 12pF,SMD0805 soldering
2 C5 1 100nF,SMD0805
3 C7 1 10uF/10VTantal Elko B
4 C8 1 10nF SMD0805
5 D1 1 LED3T1 3mm yellow RS:228-4991
MicroCrystal MS1V-T1K
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering
12.5pF
DNP:Headers and receptacles
7 J1, J2 2 14-pin header, TH male enclosedwith kit. Keep vias free of
solder.:Header: Receptacle
DNP:Headers and receptacles
14-pinheader, TH
7.1 2 enclosedwith kit. Keep vias free of
female solder.:Header: Receptacle
8 J3 1 3-Pin Connector,male
9 J4, J5 2 2-Pin Connector, male Withjumper
10 BOOTST 0 ML10,10-Pin Conn., m RS:482-115 DNP,Cover holes while soldering
11 JTAG 1 ML14,14-Pin Conn., m RS: 482-121
R1,R2,
R6,R7,
12 4 0R,SMD0805 DNP:R1, R2, R9, R10
R8,R9,
R10,R11
13 R3 1 560R,SMD0805
14 R5 1 47K,SMD0805
Yamaichi:
15 U1 1 SOP28DWsocket IC189-0282-042
16 U2 0 TSSOP DNP
48 Hardware SLAU278F–May 2009 –Revised December 2010
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