Texas Instruments MSP430 manual Table B-6. MSP-TS430DW28 Bill of Materials, Bootst, Tssop DNP

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Table B-6. MSP-TS430DW28 Bill of Materials

Position	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP: C1, C2, Cover holes while
					soldering
2	C5	1	100nF, SMD0805
3	C7	1	10uF/10V Tantal Elko B
4	C8	1	10nF	SMD0805
5	D1	1	LED3 T1 3mm yellow	RS: 228-4991
				Micro Crystal MS1V-T1K
6	Q1	0	QUARZ, Crystal	32.768kHz, C(Load) =	DNP: Cover holes while soldering
				12.5pF
					DNP: Headers and receptacles
7	J1, J2	2	14-pin header, TH male		enclosed with kit. Keep vias free of
					solder.: Header: Receptacle
			14-pin header, TH		DNP: Headers and receptacles
7.1		2			enclosed with kit. Keep vias free of
			female
					solder.: Header: Receptacle
8	J3	1	3-Pin Connector, male
9	J4, J5	2	2-Pin Connector, male		With jumper
10	BOOTST	0	ML10, 10-Pin Conn., m	RS: 482-115	DNP, Cover holes while soldering
11	JTAG	1	ML14, 14-Pin Conn., m	RS: 482-121
	R1, R2,
12	R6, R7,	4	0R, SMD0805		DNP: R1, R2, R9, R10
	R8,R9,
	R10, R11
13	R3	1	560R, SMD0805
14	R5	1	47K, SMD0805
15	U1	1	SOP28DW socket	Yamaichi:
				IC189-0282-042
16	U2	0	TSSOP		DNP

48	Hardware	SLAU278F –May 2009 –Revised December 2010
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