MSP-TS430RHA40A

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Table B-12. MSP-TS430RHA40A Bill of Materials
No.per
Position RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF, SMD0805 DNP:C1, C2
2 C5 0 2.2nF,SMD0805 DNPC12
3 C3,C7 2 10uF/10V,SMD0805 5 DNPC11
4 C4,C6 2 100nF,SMD0805 478-3351-2-ND
5 C9 1 470nF, SMD0805
6 D1 1 greenLED, SMD0805 P516TR-ND
DNP:headers and receptacles
J1,J2, J3,
7 4 10-pin header, TH enclosedwith kit. Keep vias free of
J4 solder.: Header : Receptacle
DNP:headers and receptacles
7.1 4 10-pin header, TH enclosedwith kit. Keep vias free of
solder.: Header : Receptacle
J5,JP1,
JP4,JP5, Placejumper on 1-2 of JP4-JP9;
8 8 3-pin header, male, TH SAM1035-03-ND
JP6,JP7, Placeon 1-2 on JP1
JP8,JP9
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND placejumper on header
10 9 Jumper 15-38-1024-ND seePos 8 an 9
14-pinconnector, male,
11 JTAG 1 HRP14H-ND
TH
10-pinconnector, male,
12 BOOTST 0 DNP.Keep vias free of solder
TH
13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
MicroCrystal MS3V-T1R
14 Q1 0 Crystal 32.768kHz, C(Load) = DNP:Q1. Keep vias free of solder
12.5pF
15 R1,R7 2 330RSMD0805 541-330ATR-ND
R2,R3,
16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2,R3, R5, R6
R8,R9,
17 R4 1 47kSMD0805
18 PCB 1 79 x 66 mm 2layers
Rubber selectappropriate; e.g.,
19 4 applyto corners at bottom side
standoff Buerklin:20H1724
DNP:enclosed with kit. Is supplied by
20 MSP430 2 MSP430N5736IRHA TI
66 Hardware SLAU278F–May 2009 –Revised December 2010
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