Texas Instruments manual Table B-12. MSP-TS430RHA40A Bill of Materials, MSP430N5736IRHA

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Table B-12. MSP-TS430RHA40A Bill of Materials

Position	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP: C1, C2
2	C5	0	2.2nF, SMD0805		DNP C12
3	C3, C7	2	10uF/10V, SMD0805 5		DNP C11
4	C4, C6	2	100nF, SMD0805	478-3351-2-ND
5	C9	1	470nF, SMD0805
6	D1	1	green LED, SMD0805	P516TR-ND
	J1, J2, J3,				DNP: headers and receptacles
7		4	10-pin header, TH		enclosed with kit. Keep vias free of
	J4
					solder. : Header : Receptacle
					DNP: headers and receptacles
7.1		4	10-pin header, TH		enclosed with kit. Keep vias free of
					solder. : Header : Receptacle
	J5, JP1,
8	JP4, JP5,	8	3-pin header, male, TH	SAM1035-03-ND	Place jumper on 1-2 of JP4-JP9;
	JP6, JP7,				Place on 1-2 on JP1
	JP8, JP9
9	JP2, JP3	2	2-pin header, male, TH	SAM1035-02-ND	place jumper on header
10		9	Jumper	15-38-1024-ND	see Pos 8 an 9
11	JTAG	1	14-pin connector, male,	HRP14H-ND
			TH
12	BOOTST	0	10-pin connector, male,		DNP. Keep vias free of solder
			TH
13	U1	1	Socket: QFN-40B-0.5-01		Manuf.: Enplas
				Micro Crystal MS3V-T1R
14	Q1	0	Crystal	32.768kHz, C(Load) =	DNP: Q1. Keep vias free of solder
				12.5pF
15	R1,R7	2	330R SMD0805	541-330ATR-ND
	R2, R3,
16	R5, R6,	2	0 Ohm, SMD0805	541-000ATR-ND	DNP:R2, R3, R5, R6
	R8, R9,
17	R4	1	47k SMD0805
18	PCB	1	79 x 66 mm		2 layers
19	Rubber	4		select appropriate; e.g.,	apply to corners at bottom side
	stand off			Buerklin: 20H1724
20	MSP430	2	MSP430N5736IRHA		DNP: enclosed with kit. Is supplied by
					TI

66	Hardware	SLAU278F –May 2009 –Revised December 2010
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