Texas Instruments manual Table B-19. MSP-TS430PN80 Bill of Materials, MSP430FG439IPN

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Table B-19. MSP-TS430PN80 Bill of Materials

Pos.	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP: C1, C2
					DNP: Only
1.1	C3, C4	0	47pF, SMD0805		recommendation. Check
					your crystal spec.
2	C6, C7	1	10uF/10V, Tantal Size B	511-1463-2-ND
3	C5	1	100nF, SMD0805	478-3351-2-ND
4	C8	1	10nF, SMD0805	478-1383-2-ND
5	D1	1	green LED, SMD0603	475-1056-2-ND
					DNP: Headers and
	J1, J2, J3,			SAM1029-20-NDSAM1213-	receptacles enclosed with
6		0	25-pin header, TH		kit.Keep vias free of
	J4			20-ND	solder.: Header:
					Receptacle
7	J5, JP1	2	3-pin header, male, TH	SAM1035-03-ND
8	J6, JP2	2	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
9		3	Jumper	15-38-1024-ND	Place on: J6, JP2,
					JP1/Pos1-2
10	JTAG	1	14-pin connector, male, TH	HRP14H-ND
11	BOOTST	0	10-pin connector, male, TH		DNP: Keep vias free of
					solder
				Q1: Micro Crystal	DNP: Keep vias free of
12	Q1, Q2	0	Crystal	MS1V-T1K 32.768kHz,
					solder
				C(Load) = 12.5pF
13	R3	1	560 Ω, SMD0805	541-560ATR-ND
	R1, R2, R4,		0 Ω, SMD0805		DNP: R4, R6, R7, R10,
14	R6, R7, R10,	2		541-000ATR-ND
					R11, R12
	R11, R12
15	R5	1	47k Ω, SMD0805	541-47000ATR-ND
16	U1	1	Socket: IC201-0804-014		Manuf.: Yamaichi
17	PCB	1	77 x 77 mm		2 layers
18	Adhesive	4	~6mm width, 2mm height	e.g., 3M Bumpons Part No.	Apply to corners at bottom
	Plastic feet			SJ-5302	side
19	MSP430	2	MSP430FG439IPN		DNP: Enclosed with kit
					supplied by TI

88	Hardware	SLAU278F –May 2009 –Revised December 2010
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