Texas Instruments manual Table B-15. MSP-TS430PM64 Bill of Materials, DNP C6, MSP430F417IPM

www.ti.comMSP-TS430PM64

Table B-15. MSP-TS430PM64 Bill of Materials

Pos.	Ref Des	No. per	Description	DigiKey Part No.	Comment
		Board
1	C1, C2	0	12pF, SMD0805		DNP
					DNP: Only
1.1	C3, C4	0	47pF, SMD0805		recommendation. Check
					your crystal spec.
2	C6, C7	1	10uF/10V, Tantal Size B	511-1463-2-ND	DNP: C6
3	C5	1	100nF, SMD0805	478-3351-2-ND
4	C8	1	10nF, SMD0805	478-1383-2-ND
5	C9	1	470nF, SMD0805	478-1403-2-ND
6	D1	1	green LED, SMD0805	P516TR-ND
					DNP: Headers and
	J1, J2, J3,			SAM1029-16-NDSAM1213-	receptacles enclosed with
7		0	16-pin header, TH		kit.Keep vias free of
	J4			16-ND	solder.: Header:
					Receptacle
8	J5	1	3-pin header, male, TH	SAM1035-03-ND
9	J6, J7	2	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
11		2	Jumper	15-38-1024-ND	Place on: J6, J7
12	JTAG	1	14-pin connector, male, TH	HRP14H-ND
13	BOOTST	0	10-pin connector, male, TH		DNP: Keep vias free of
					solder
				Q1: Micro Crystal	DNP: Keep vias free of
14	Q1, Q2	0	Crystal	MS1V-T1K 32.768kHz,
					solder
				C(Load) = 12.5pF
15	R3	1	330 Ω, SMD0805	541-330ATR-ND
	R1, R2, R4,
	R6, R7, R8,		0 Ω, SMD0805		DNP: R4, R6, R7, R9, R10,
16	R9, R10,	3		541-000ATR-ND
					R11, R12, R13, R14
	R11, R12,
	R13, R14
17	R5	1	47k Ω, SMD0805	541-47000ATR-ND
18	U1	1	Socket: IC51-0644-807		Manuf.: Yamaichi
19	PCB	1	78 x 75 mm		2 layers
20	Rubber	4		select appropriate	Apply to corners at bottom
	standoff				side
21	MSP430	22	MSP430F2619IPM		DNP: Enclosed with kit
			MSP430F417IPM		supplied by TI

SLAU278F –May 2009 –Revised December 2010	Hardware	75
Submit Documentation Feedback

© 2009–2010, Texas Instruments Incorporated