MSP-TS430PZ100B

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Table B-24. MSP-TS430PZ100B Bill of Materials
No.per
Position RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP
C4,C5, C6
2 , C7, C8, 6 100nF,SMD0805 311-1245-2-ND
C9
3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND
4 C11, C12 1 10 uF / 6.3 V SMD0805 C12DNP
C13,C14,
5 C16, C18, 6 4.7 uF SMD0805
C19,C29
6 D1 1 greenLED, SMD0805 P516TR-ND
SAM1029-25-ND DNP:Headers and receptacles
J1,J2, J3, (Header)
7 0 25-pin header, TH enclosedwith kit. Keep vias free of
J4 SAM1213-25-ND solder:
(Receptacle)
8 J5 1 3-pin header,male, TH
JP3,JP5, placejumpers on pins 2-3 on JP5,
JP6,JP7,
9 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place
JP8,JP9, jumperson pins 1-2 on JP3,
JP10
JP1,JP2,
10 3 2-pinheader, male, TH SAM1035-02-ND Place jumper on header
JP4
JP11,
11 3 4-pinheader, male, TH place jumper on header 1-2
JP12,JP13
12 13 Jumper 15-38-1024-ND SeePos. 9 and Pos. 10 and Pos. 11
14-pinconnector, male,
15 JTAG 1 HRP14H-ND
TH
10-pinconnector, male,
16 BOOTST 0 "DNPKeep vias free of solder"
TH
17 Q1 0 Crystal DNP:Q1 Keep vias free of solder
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1,R2,
R4,R6,
22 2 0Ohm, SMD0805 541-000ATR-ND DNP:R4, R6, R8, R10, R11
R8,R10,
R11
23 R5 1 47kΩ, SMD0805 541-47000ATR-ND
24 U1 1 Socket:IC357-1004-53N Manuf.:Yamaichi
25 PCB 1 90 x 82 mm 2layers
Adhesive about6mm width, 2mm e.g.,3M Bumpons Part
26 4 Applyto corners at bottom side
plasticfeet height No. SJ-5302
27 MSP430 2 MSP430F6733IPZ DNP:enclosed with kit, supplied by TI
104 Hardware SLAU278F–May 2009 –Revised December 2010
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