Table B-26. MSP-TS430PZ100USB Bill of Materials
| Pos. | Ref Des | No. Per | Description | DigiKey Part No. | Comment |
| Board | |||||
|
|
|
|
|
| |
|
|
|
|
|
|
|
| 1 | C1, C2 | 0 | 12pF, SMD0805 |
| DNP: C1, C2 |
|
|
|
|
|
|
|
| 1.1 | C3, C4 | 2 | 47pF, SMD0805 |
|
|
|
|
|
|
|
|
|
| 2 | C6, C7 | 2 | 10uF/6.3V, Tantal Size B |
| |
|
|
|
|
|
|
|
|
| C5, C11, |
|
|
|
|
| 3 | C13, C14, | 5 | 100nF, SMD0805 |
| |
|
| C19 |
|
|
|
|
|
|
|
|
|
|
|
| 3.1 | C10, C12, | 0 | 100nF, SMD0805 | DNP: C10, C12,C18, C17 | |
| C18,17 | |||||
|
|
|
|
|
| |
|
|
|
|
|
|
|
| 4 | C8 | 1 | 2.2nF, SMD0805 |
|
|
|
|
|
|
|
|
|
| 5 | C9 | 1 | 470nF, SMD0805 |
| |
|
|
|
|
|
|
|
| 6 | D1 | 1 | green LED, SMD0805 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| DNP: headers and |
|
|
|
|
|
| receptacles enclosed with kit. |
| 7 | J1, J2, J3, J4 | 4 | Keep vias free of solder. | ||
|
|
|
|
|
| : Header |
|
|
|
|
|
| : Receptacle |
|
|
|
|
|
|
|
|
|
|
|
|
| DNP: headers and |
|
|
|
|
|
| receptacles enclosed with kit. |
| 7.1 |
| 4 | Keep vias free of solder. | ||
|
|
|
|
|
| : Header |
|
|
|
|
|
| : Receptacle |
|
|
|
|
|
|
|
| 8 | J5 | 1 |
| ||
|
|
|
|
|
|
|
|
| JP5, JP6, |
|
|
|
|
| 9 | JP7, JP8, | 6 | place jumpers on pins | ||
|
| JP9, JP10 |
|
|
|
|
|
|
|
|
|
|
|
| 10 | JP1, JP2, | 3 | place jumper on header | ||
| JP4 | |||||
|
|
|
|
|
| |
|
|
|
|
|
|
|
| 11 | JP3 | 1 | place jumper on pins | ||
|
|
|
|
|
|
|
|
|
|
|
|
| Place on: JP1, JP2, JP3, |
| 12 |
| 10 | Jumper | JP4, JP5, JP6, JP7, JP8, | |
|
|
|
|
|
| JP9, JP10 |
|
|
|
|
|
|
|
| 13 | JTAG | 1 |
|
| |
|
|
|
|
|
|
|
|
|
|
|
| Micro Crystal | DNP: Q1. Keep vias free of |
| 14 | Q1 | 0 | Crystal | 32.768kHz, C(Load) = | |
| solder | |||||
|
|
|
|
| 12.5pF | |
|
|
|
|
|
| |
|
|
|
|
|
|
|
| 15 | Q2 | 1 | Crystal | Q2: 4MHz, Buerklin: 78D134 |
|
|
|
|
|
|
|
|
| 16 | R3, R7 | 2 | 330 Ω, SMD0805 |
| |
|
|
|
|
|
|
|
|
| R1, R2, R4, |
| 0 Ω, SMD0805 |
|
|
| 17 | R6, R8, R9, | 3 | DNP: R6, R8, R9, R12 | ||
|
| R12 |
|
|
|
|
|
|
|
|
|
|
|
| 18 | R10 | 1 | 100 Ω, SMD0805 | Buerklin: 07E500 |
|
|
|
|
|
|
|
|
| 18 | R11 | 1 | 1M Ω, SMD0603 |
| not existing in Rev 1.0 |
|
|
|
|
|
|
|
| 18 | R5 | 1 | 47k Ω, SMD0805 |
| |
|
|
|
|
|
|
|
| 19 | U1 | 1 |
| Manuf.: Yamaichi | |
|
|
|
|
|
|
|
| 20 | PCB | 1 | 79 x 77 mm |
| 2 layers |
|
|
|
|
|
|
|
| 21 | Rubber stand | 4 |
| Buerklin: 20H1724 | apply to corners at bottom |
| off |
| side | |||
|
|
|
|
| ||
|
|
|
|
|
|
|
| 22 | MSP430 | 2 | MSP430F5529 |
| DNP: enclosed with kit. Is |
|
| supplied by TI | ||||
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
| nsulating disk |
|
| http://www.ettinger.de/Art_De |
|
| 23 | 1 | Insulating disk to Q2 | tail.cfm?ART_ARTNUM=70.0 |
| |
| to Q2 |
| ||||
|
|
|
| 8.121 |
| |
|
|
|
|
|
| |
|
|
|
|
|
|
|
| 24 | C16 | 1 | 4.7 nF SMD0603 |
|
|
|
|
|
|
|
|
|
| 27 | C33 | 1 | 220n SMD0603 | Buerklin: 53D2074 |
|
|
|
|
|
|
|
|
| 28 | C35, C36 | 2 | 10p SMD0603 | Buerklin: 56D102 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
110 Hardware |
|
|
| SLAU278F | ||
|
|
|
|
| Submit Documentation Feedback |
©