MSP-TS430PZ100USBwww.ti.com

Table B-26. MSP-TS430PZ100USB Bill of Materials

 

Pos.

Ref Des

No. Per

Description

DigiKey Part No.

Comment

 

Board

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

C1, C2

0

12pF, SMD0805

 

DNP: C1, C2

 

 

 

 

 

 

 

 

1.1

C3, C4

2

47pF, SMD0805

 

 

 

 

 

 

 

 

 

 

2

C6, C7

2

10uF/6.3V, Tantal Size B

511-1463-2-ND

 

 

 

 

 

 

 

 

 

 

C5, C11,

 

 

 

 

 

3

C13, C14,

5

100nF, SMD0805

311-1245-2-ND

 

 

 

C19

 

 

 

 

 

 

 

 

 

 

 

 

3.1

C10, C12,

0

100nF, SMD0805

311-1245-2-ND

DNP: C10, C12,C18, C17

 

C18,17

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4

C8

1

2.2nF, SMD0805

 

 

 

 

 

 

 

 

 

 

5

C9

1

470nF, SMD0805

478-1403-2-ND

 

 

 

 

 

 

 

 

 

6

D1

1

green LED, SMD0805

P516TR-ND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DNP: headers and

 

 

 

 

 

 

receptacles enclosed with kit.

 

7

J1, J2, J3, J4

4

25-pin header, TH

SAM1029-25-ND

Keep vias free of solder.

 

 

 

 

 

 

: Header

 

 

 

 

 

 

: Receptacle

 

 

 

 

 

 

 

 

 

 

 

 

 

DNP: headers and

 

 

 

 

 

 

receptacles enclosed with kit.

 

7.1

 

4

25-pin header, TH

SAM1213-25-ND

Keep vias free of solder.

 

 

 

 

 

 

: Header

 

 

 

 

 

 

: Receptacle

 

 

 

 

 

 

 

 

8

J5

1

3-pin header, male, TH

SAM1035-03-ND

 

 

 

 

 

 

 

 

 

 

JP5, JP6,

 

 

 

 

 

9

JP7, JP8,

6

3-pin header, male, TH

SAM1035-03-ND

place jumpers on pins 2-3

 

 

JP9, JP10

 

 

 

 

 

 

 

 

 

 

 

 

10

JP1, JP2,

3

2-pin header, male, TH

SAM1035-02-ND

place jumper on header

 

JP4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11

JP3

1

3-pin header, male, TH

SAM1035-03-ND

place jumper on pins 1-2

 

 

 

 

 

 

 

 

 

 

 

 

 

Place on: JP1, JP2, JP3,

 

12

 

10

Jumper

15-38-1024-ND

JP4, JP5, JP6, JP7, JP8,

 

 

 

 

 

 

JP9, JP10

 

 

 

 

 

 

 

 

13

JTAG

1

14-pin connector, male, TH

HRP14H-ND

 

 

 

 

 

 

 

 

 

 

 

 

 

Micro Crystal MS1V-T1K

DNP: Q1. Keep vias free of

 

14

Q1

0

Crystal

32.768kHz, C(Load) =

 

solder

 

 

 

 

 

12.5pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15

Q2

1

Crystal

Q2: 4MHz, Buerklin: 78D134

 

 

 

 

 

 

 

 

 

16

R3, R7

2

330 Ω, SMD0805

541-330ATR-ND

 

 

 

 

 

 

 

 

 

 

R1, R2, R4,

 

0 Ω, SMD0805

 

 

 

17

R6, R8, R9,

3

541-000ATR-ND

DNP: R6, R8, R9, R12

 

 

R12

 

 

 

 

 

 

 

 

 

 

 

 

18

R10

1

100 Ω, SMD0805

Buerklin: 07E500

 

 

 

 

 

 

 

 

 

18

R11

1

1M Ω, SMD0603

 

not existing in Rev 1.0

 

 

 

 

 

 

 

 

18

R5

1

47k Ω, SMD0805

541-47000ATR-ND

 

 

 

 

 

 

 

 

 

19

U1

1

Socket:IC201-1004-008

 

Manuf.: Yamaichi

 

 

 

 

 

 

 

 

20

PCB

1

79 x 77 mm

 

2 layers

 

 

 

 

 

 

 

 

21

Rubber stand

4

 

Buerklin: 20H1724

apply to corners at bottom

 

off

 

side

 

 

 

 

 

 

 

 

 

 

 

 

 

22

MSP430

2

MSP430F5529

 

DNP: enclosed with kit. Is

 

 

supplied by TI

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

nsulating disk

 

 

http://www.ettinger.de/Art_De

 

 

23

1

Insulating disk to Q2

tail.cfm?ART_ARTNUM=70.0

 

 

to Q2

 

 

 

 

 

8.121

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24

C16

1

4.7 nF SMD0603

 

 

 

 

 

 

 

 

 

 

27

C33

1

220n SMD0603

Buerklin: 53D2074

 

 

 

 

 

 

 

 

 

28

C35, C36

2

10p SMD0603

Buerklin: 56D102

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

110 Hardware

 

 

 

SLAU278F –May 2009 –Revised December 2010

 

 

 

 

 

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Texas Instruments MSP430 manual Table B-26. MSP-TS430PZ100USB Bill of Materials