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MSP-TS430DL48

Table B-13. MSP-TS430DL48 Bill of Materials
No.per
Pos. RefDes Description DigiKeyPart No. Comment
Board
1 C1,C2 0 12pF,SMD0805 DNP
2 C4,C7 2 10uF/10V,Tantal Size B 511-1463-2-ND
3 C3,C5 2 100nF,SMD0805 478-3351-2-ND
4 C8 1 10nF,SMD0805 478-1383-2-ND
5 D1 1 yellowLED, TH, 3mm, T1 511-1251-ND
DNP:Headers and
receptaclesenclosed with
SAM1034-12-NDSAM1212-
6 J1, J2 0 24-pinheader, TH kit.Keepvias free of
12-ND solder.:Header:
Receptacle
Placejumper on header
7 J3,JP1, JP2 2 3-pinheader, male, TH SAM1035-03-ND JP1;Pos 1-2. DNP: JP2
8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Placeon: JP1, J4, J5
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP:Keep vias free of
11 BOOTST 0 10-pinconnector, male, TH solder
MicroCrystal MS1V-T1K DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
13 R3 1 560Ω, SMD0805 541-560ATR-ND
R4,R6, R7,
14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7
R12
15 R5 1 47kΩ, SMD0805 541-47000ATR-ND
Socket:IC51-1387
16 U1 1 Manuf.:Yamaichi
KS-15186
17 PCB 1 58x 66 mm 2layers
Adhesive e.g., 3M Bumpons Part No. Applyto corners at bottom
18 4 ~6mm width, 2mm height
Plasticfeet SJ-5302 side
DNP:Enclosed with kit
19 MSP430 2 MSP430F4270IDL suppliedby TI
69
SLAU278F–May 2009 –Revised December 2010 Hardware
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