JP4

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Table B-17. MSP-TS430RGC64B Bill of Materials

Position	Ref Des	No. per	Description	DigiKey Part No.	Comment
Position	Ref Des	Board	Description	DigiKey Part No.	Comment
		Board

1	C1, C2	0	12pF, SMD0805		DNP

2	C3, C4	0	47pF, SMD0805		DNP

3	C6, C7,	3	10uF/6.3V, SMD0805
3	C10	3	10uF/6.3V, SMD0805
	C10

	C5, C11,
4	C13, C14,	5	100nF, SMD0805	311-1245-2-ND
	C15

5	C8	1	2.2nF, SMD0805

6	C9	1	470nF, SMD0805	478-1403-2-ND

7	C16	1	4.7uF, SMD0805

8	C17	1	220nF, SMD0805

9	D1	1	green LED, SMD0805	P516TR-ND

				SAM1029-16-ND	DNP: Headers and receptacles
	J1, J2, J3,			(Header)	DNP: Headers and receptacles
10	J1, J2, J3,	0	16-pin header, TH	(Header)	enclosed with kit. Keep vias free of
10	J4	0	16-pin header, TH	SAM1213-16-ND	enclosed with kit. Keep vias free of
	J4			SAM1213-16-ND	solder:
				(Receptacle)	solder:
				(Receptacle)

11	J5 , J6	2	3-pin header, male, TH

	JP3, JP5,				place jumpers on pins 2-3 on JP5,
	JP6, JP7,				place jumpers on pins 2-3 on JP5,
12	JP6, JP7,	7	3-pin header, male, TH	SAM1035-03-ND	JP6, JP7, JP8, JP9, JP10 place
12	JP8, JP9,	7	3-pin header, male, TH	SAM1035-03-ND	JP6, JP7, JP8, JP9, JP10 place
	JP8, JP9,				jumpers on pins 1-2 on JP3,
	JP10				jumpers on pins 1-2 on JP3,
	JP10

13	JP1, JP2,	3	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
13	JP4	3	2-pin header, male, TH	SAM1035-02-ND	Place jumper on header
	JP4

14		10	Jumper	15-38-1024-ND	See Pos. 12 and Pos. 13

15	JTAG	1	14-pin connector, male,	HRP14H-ND
15	JTAG	1	TH	HRP14H-ND
			TH

16	BOOTST	0	10-pin connector, male,		"DNP Keep vias free of solder"
16	BOOTST	0	TH		"DNP Keep vias free of solder"
			TH

				Micro Crystal MS3V-T1R
17	Q1	0	Crystal	32.768kHz, C(Load) =	DNP: Q1 Keep vias free of solder
				12.5pF

18	Q2	0	Crystal	Q2: 4MHz Buerklin:	DNP: Q2 Keep vias free of solder
18	Q2	0	Crystal	78D134	DNP: Q2 Keep vias free of solder
				78D134

	Insulating			http://www.ettinger.de/Ar
19	Insulating	0	Insulating disk to Q2	t_Detail.cfm?ART_ART
19	disk to Q2	0	Insulating disk to Q2	t_Detail.cfm?ART_ART
	disk to Q2			NUM=70.08.121
				NUM=70.08.121

20	R3, R7	2	330 Ω, SMD0805	541-330ATR-ND

	R1, R2,
	R4, R6,
21	R8,	3	0 Ohm, SMD0805	541-000ATR-ND	DNP: R6, R8, R9, R10, R11,R12
	R9,R10,
	R11, R12

22	R5	1	47k Ω, SMD0805	541-47000ATR-ND

23	U1	1	Socket:		Manuf.: Yamaichi
23	U1	1	QFN11T064-006-N-HSP		Manuf.: Yamaichi
			QFN11T064-006-N-HSP

24	PCB	1	85 x 76 mm		2 layers

25	Adhesive	4	about 6mm width, 2mm	e.g., 3M Bumpons Part	Apply to corners at bottom side
25	plastic feet	4	height	No. SJ-5302	Apply to corners at bottom side
	plastic feet		height	No. SJ-5302

26	D3,D4

27	MSP430	2	MSP430F5310 RGC		DNP: enclosed with kit, supplied by TI

SLAU278F –May 2009 –Revised December 2010	Hardware	81
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Texas Instruments MSP430 manual Table B-17. MSP-TS430RGC64B Bill of Materials, JP4

Models: MSP430

Table B-17. MSP-TS430RGC64B Bill of Materials

Position

HRP14H-ND

BOOTST

PCB

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