Texas Instruments MSP430 Table B-17. MSP-TS430RGC64B Bill of Materials

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MSP-TS430RGC64B

Table B-17. MSP-TS430RGC64B Bill of Materials

No.per

Position RefDes Description DigiKeyPart No. Comment

Board

1 C1,C2 0 12pF,SMD0805 DNP

2 C3,C4 0 47pF,SMD0805 DNP

C6,C7,

3 3 10uF/6.3V,SMD0805

C10

C5,C11,

4 C13, C14, 5 100nF,SMD0805 311-1245-2-ND

C15

5 C8 1 2.2nF,SMD0805

6 C9 1 470nF,SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805

9 D1 1 greenLED, SMD0805 P516TR-ND

SAM1029-16-ND DNP:Headers and receptacles

J1,J2, J3, (Header)

10 0 16-pin header, TH enclosedwith kit. Keep vias free of

J4 SAM1213-16-ND solder:

(Receptacle)

11 J5, J6 2 3-pinheader, male, TH

JP3,JP5, placejumpers on pins 2-3 on JP5,

JP6,JP7,

12 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place

JP8,JP9, jumperson pins 1-2 on JP3,

JP10

JP1,JP2,

13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

JP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13

14-pinconnector, male,

15 JTAG 1 HRP14H-ND

10-pinconnector, male,

16 BOOTST 0 "DNPKeep vias free of solder"

MicroCrystal MS3V-T1R

17 Q1 0 Crystal 32.768kHz,C(Load) = DNP:Q1 Keep vias free of solder

12.5pF

Q2:4MHz Buerklin:

18 Q2 0 Crystal DNP:Q2 Keep vias free of solder

78D134

http://www.ettinger.de/Ar

Insulating

19 0 Insulating disk to Q2 t_Detail.cfm?ART_ART

diskto Q2 NUM=70.08.121

20 R3,R7 2 330Ω, SMD0805 541-330ATR-ND

R1,R2,

R4,R6,

21 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP:R6,R8, R9, R10, R11,R12

R9,R10,

R11,R12

22 R5 1 47kΩ, SMD0805 541-47000ATR-ND

Socket:

23 U1 1 Manuf.: Yamaichi

QFN11T064-006-N-HSP

24 PCB 1 85x 76 mm 2layers

Adhesive about6mm width, 2mm e.g., 3M Bumpons Part

25 4 Applyto corners at bottom side

plasticfeet height No. SJ-5302

26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP:enclosed with kit, supplied by TI

SLAU278F–May 2009 –Revised December 2010 Hardware