Intel IXP46X, IXP45X manual DDR-266 Sdram Interface, Signal Interface, Soft Fusible Features

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Intel® IXP45X and Intel® IXP46X Product Line of Network Processors—General Hardware Design Considerations

Table 3.

Soft Fusible Features

 

 

 

 

Name

Description

 

 

 

 

PCI

The complete bus must be enabled or disable.

 

 

 

 

HSS0/1

Can only be disable as a pair.

 

 

 

 

UTOPIA

If enabling UTOPIA, MACs on NPE A are disabled.

 

If enabling MACs on NPE A, UTOPIA are disabled.

 

 

 

 

 

 

ETHERNET

Can Enable either MII MACs or SMII MACs, but not both at the same time. Enable of MACs

 

can be separately done per each NPE.

 

 

 

 

 

 

USB Host

Each USB can be Enable separately.

 

 

 

 

USB Device

Each USB can be Enable separately.

 

 

 

 

DDR ECC

DDR can be disabled separately form the rest of the DDR interface.

 

 

 

3.2DDR-266 SDRAM Interface

The IXP45X/IXP46X network processors support unbuffered, DDR-266 SDRAM technology, capable of addressing two memory banks (one bank per CS). Each bank can be configured to support 32/64/128/256/512-Mbyte for a total combined memory support of 1 Gbyte.

The device supports non-ECC and ECC for error correction, which can be enable or disable by software as required. Banks have a bus width of 32 bits for non ECC or 40 bits for ECC enable (32-bit data + 8-bit ECC).

For a complete feature list, see the Intel® IXP45X and Intel® IXP46X Product Line of Network Processors Datasheet.

General DDR SDRAM routing guidelines can be found in Section 7.1.7, “Routing Guidelines” on page 88. For more detailed information, see the PC266 DDR SDRAM specification.

3.2.1Signal Interface

Table 4.

DDR SDRAM Interface Pin Description (Sheet 1 of 2)

 

 

 

 

 

 

 

 

Input

 

VTT

 

Name

 

Outpu

Device-Pin Connection

Terminatio

Description

 

 

t

 

n

 

 

 

 

 

 

 

 

 

 

Connect a pair of differential clock

 

 

DDRI_CK[2:0]

 

O

signals to every device; When

 

DDR SDRAM Clock Out — Provides the positive

 

using both banks, daisy chain

No

differential clocks to the external SDRAM

 

 

 

devices with same data bit

 

memory subsystem.

 

 

 

sequence.

 

 

 

 

 

 

 

 

 

 

 

 

 

DDR SDRAM Clock Out — Provides the

DDRI_CK_N[2:0]

 

O

Same as above

No

negative differential clocks to the external

 

 

 

 

 

SDRAM memory subsystem.

 

 

 

 

 

 

 

 

 

Use the same CS to control 32-bit

 

Chip Select — Must be asserted for all

DDRI_CS_N[1:0]

 

O

Yes

transactions to the DDR SDRAM device. One

 

data + 8-bit ECC, per bank

 

 

 

 

per bank.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The RAS signal must be connected

 

Row Address Strobe — Indicates that the

DDRI_RAS_N

 

O

to each device in a daisy chain

Yes

 

current address on DDRI_MA[13:0] is the row.

 

 

 

manner

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The CAS signal must be connected

 

Column Address Strobe — Indicates that the

DDRI_CAS_N

 

O

to each device in a daisy chain

Yes

current address on DDRI_MA[13:0] is the

 

 

 

manner

 

column.

 

 

 

 

 

 

Intel® IXP45X and Intel® IXP46X Product Line of Network Processors

 

HDD

February 2007

18

Document Number: 305261; Revision: 004

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Contents Hardware Design Guidelines FebruaryHDD Contents 12.1 Figures Control Group Topology Transmission Line Characteristics TablesRevision History Date Revision DescriptionHDD Content Overview Chapter Name DescriptionRelated Documentation Title Document #Overview List of Acronyms and AbbreviationsTerm Explanation Smii Intel IXP465 Component Block Diagram Typical Applications DslamSystem Architecture Description System Memory MapIntel IXP465 Example System Block Diagram Soft Fusible Features Signal Type DefinitionsSymbol Description DDR-266 Sdram Interface Signal InterfaceSoft Fusible Features DDR Sdram Interface Pin Description Sheet 1Ddrircveninn DDR Sdram Interface Pin Description Sheet 2Ddriwen DdrircompExpansion Bus DDR Sdram Memory InterfaceDDR Sdram Initialization Reset Configuration Straps Expansion Bus Signal RecommendationsInput Pull Name Recommendations Output Down Boot/Reset Strapping Configuration Sheet 1 Name Function DescriptionBoot/Reset Strapping Configuration Sheet 2 3 8-Bit Device Interface4 16-Bit Device Interface 5 32-Bit Device Interface Bit Device 16/32-Bit Device Interface Byte Enable Flash Interface Flash Interface ExampleUart Interface Sram InterfaceDesign Notes Uart Signal Recommendations Name Input Pull Recommendations Output DownMII/SMII Interface Uart Interface ExampleSignal Interface MII MII NPE a Signal RecommendationsMII NPE B Signal Recommendations Sheet 1 MII NPE B Signal Recommendations Sheet 2 MII NPE C Signal RecommendationsMAC Management Signal Recommendations NPE A,B,C Device Connection, MIINPE A,B,C Signal Interface, Smii Smii Signal Recommendations NPE A, B, CGpio Interface Device Connection, SmiiGpio Signal Recommendations I2C Signal Recommendations I2C InterfaceDevice Connection USB Interface I2C Eeprom Interface ExampleUSB Host/Device Signal Recommendations Host Device Utopia Level 2 Interface USB Device Interface ExampleUtopia Signal Recommendations HSS Interface Utopia Interface ExampleHSSTXCLK0 High-Speed, Serial InterfaceHSSTXDATA0 HSSRXDATA0HSSRXDATA1 HSSTXDATA1HSSTXCLK1 HSSRXCLK1SSP Interface HSS Interface ExampleSynchronous Serial Peripheral Port Interface PCI Interface PCI Controller Sheet 1Input Pull Name Outpu Recommendations Down PCI Interface Block Diagram PCI Controller Sheet 2Supporting 5 V PCI Interface PCI InterfacePCI Option Interface PCI Host/Option Interface Pin Description Sheet 1PCI Host/Option Interface Pin Description Sheet 2 Jtag Interface PCI Host/Option Interface Pin Description Sheet 3Input System Clock Clock SignalsClock Signals Clock OscillatorPower Power Interface Sheet 1Name Nominal Description Voltage De-Coupling Capacitance Recommendations Power SequenceReset Timing VCC De-CouplingHDD HDD General Recommendations Component PlacementPCB Overview Component SelectionComponent Placement on a PCB Stack-Up SelectionControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout and Routing Guide General Layout GuidelinesSignal Changing Reference Planes General Component SpacingGood Design Practice for VIA Hole Placement Clock Signal Considerations Pad-to-Pad Clearance of Passive Components to a PGA or BGASmii Signal Considerations MII Signal ConsiderationsUSB Considerations Cross-Talk EMI-Design ConsiderationsPower and Ground Plane Trace ImpedanceHDD @33 MHz Electrical InterfaceTopology @66 MHzClock Distribution PCI Address/Data Routing GuidelinesParameter Routing Guidelines Trace Length Limits PCI Clock Routing GuidelinesSignal Loading Routing GuidelinesIntroduction DDR Signal GroupsGroup Signal Name Description No of Single Ended Signals DDRIDQS40DDR Sdram HDD Supported Memory Configurations Clock Banks Memory SizeVTT Selecting VTT Power Supply VTT Terminating CircuitryDDR Command and Control Setup and Hold Values Symbol Parameter Min Max UnitsDdrmclk DDR Data to DQS Read Timing Parameters DDR-Data-to-DQS-Write Timing Parameters DDR Data to DQS Write Timing ParametersPrinted Circuit Board Layer Stackup Printed Circuit Board Controlled Impedance Printed Circuit Board Layer StackupPrinted Circuit Board Controlled Impedance Signal Group Absolute Minimum Absolute Maximum Length Timing RelationshipsTiming Relationships Resistive Compensation Register Rcomp Clock GroupParameter Definition Clock Signal Group Routing GuidelinesData, Command, and Control Group Routing Guidelines DDRIBA10, DDRIRASN, DDRICASN, DdriwenClock Group Clock Group Topology Transmission Line CharacteristicsSimulation Results Transmission Line LengthDDR Clock Topology Two-Bank x16 Devices Data Group DDR Clock Simulation Results Two-Bank x16 DevicesData Group Topology Transmission Line Characteristics DDR Data Topology Two-Bank x16 Devices DDR Data Write Simulation Results Two-Bank x16 Devices HDD HDD Control Group Topology Transmission Line Characteristics Control GroupDDR RAS Simulation Results Two-Bank x16 Devices Command Group Command Group Topology Transmission Line CharacteristicsDDR Command MA3 Topology Two-Bank x16 Devices DDR Address Simulation Results Two-Bank x16 Devices DDR Command RAS Topology Two-Bank x16 Devices 104 Rcvenin and Rcvenout DDR RCVENIN/RCVENOUT TopologyDDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω 108