Intel IXP45X, IXP46X manual Electrical Interface, Topology, @33 MHz, @66 MHz

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PCI Interface Design Considerations—Intel®IXP45X and Intel® IXP46X Product Line of

Network Processors

6.0PCI Interface Design Considerations

The Intel® IXP45X and Intel® IXP46X Product Line of Network Processors has a single, 32-bit PCI device module that runs at 33/66 MHz. This chapter describes some basic guidelines to help design hardware that interfaces with PCI devices.

The PCI module is compatible with the PCI Local Bus Specification, Rev. 2.2. For a complete functional description and physical requirements, see PCI Local Bus Specification, Rev. 2.2.

6.1Electrical Interface

The electrical definition is restricted to 3.3 V signaling environment. The device is not 5 V tolerant. All devices interfacing with the PCI module need to operate at 3.3 V.

6.2Topology

Interfacing devices need to be connected in a daisy-chain topology. When more than one device is in the bus, connecting stubs need to be kept as short as possible.

There is a limitation to the number of devices connected to the internal arbiter. If more than four devices are required to be connected, an external arbiter is required.

The system time budget must be satisfied for 66 MHz and 33 MHz cycles. It is expected that if the timing budget for 66 MHz clock cycles is satisfied, then the 33 MHz cycles also work. The following equation and timing parameters need to be met when routing a board that either interfaces to a single PCI device or up to four devices as shown in Figure 26.

TCYC ≥ TVAL +TPROP + TSKEW + TSU

where:

TVAL = Valid Output Delay

TPROP = Bus Propagation Delay (maximum time for complete flight) TSKEW = Total Clock Skew

TSU = Input Setup Time

@33 MHz	TCYC = 30 nSec	TVAL = 11 nSec	TPROP = 10 nSec	TSKEW = 2 nSec	TSU = 7 nSec

@66 MHz	TCYC = 15 nSec	TVAL = 6 nSec	TPROP = 5 nSec	TSKEW = 1 nSec	TSU = 3 nSec

When defining the maximum length of segments A and B as shown in Figure 26, the calculation must:

•Include an additional trace length segment from the PCI connector to the input device within the expansion PCI card.

•Assume the segment to be 1.5 inch.

•Use trace propagation delay of 150 to 190 ps/in as specified by the PCI standard.

	Intel® IXP45X and Intel® IXP46X Product Line of Network Processors
February 2007	HDD
Document Number: 305261, Revision: 004	71

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Contents February Hardware Design GuidelinesHDD Contents 12.1 Figures Tables Control Group Topology Transmission Line CharacteristicsDate Revision Description Revision HistoryHDD Chapter Name Description Content OverviewTitle Document # Related DocumentationTerm Explanation OverviewList of Acronyms and Abbreviations Smii Intel IXP465 Component Block Diagram Dslam Typical ApplicationsSystem Memory Map System Architecture DescriptionIntel IXP465 Example System Block Diagram Symbol Description Soft Fusible FeaturesSignal Type Definitions DDR Sdram Interface Pin Description Sheet 1 Signal InterfaceSoft Fusible Features DDR-266 Sdram InterfaceDdrircomp DDR Sdram Interface Pin Description Sheet 2Ddriwen DdrircveninnDDR Sdram Initialization Expansion BusDDR Sdram Memory Interface Input Pull Name Recommendations Output Down Reset Configuration StrapsExpansion Bus Signal Recommendations Name Function Description Boot/Reset Strapping Configuration Sheet 14 16-Bit Device Interface Boot/Reset Strapping Configuration Sheet 23 8-Bit Device Interface 5 32-Bit Device Interface Bit Device 16/32-Bit Device Interface Byte Enable Flash Interface Example Flash InterfaceDesign Notes Uart InterfaceSram Interface Name Input Pull Recommendations Output Down Uart Signal RecommendationsUart Interface Example MII/SMII InterfaceMII NPE B Signal Recommendations Sheet 1 Signal Interface MIIMII NPE a Signal Recommendations MII NPE C Signal Recommendations MII NPE B Signal Recommendations Sheet 2NPE A,B,C MAC Management Signal Recommendations NPE A,B,CDevice Connection, MII Smii Signal Recommendations NPE A, B, C Signal Interface, SmiiDevice Connection, Smii Gpio InterfaceGpio Signal Recommendations Device Connection I2C Signal RecommendationsI2C Interface I2C Eeprom Interface Example USB InterfaceUSB Host/Device Signal Recommendations Host Device USB Device Interface Example Utopia Level 2 InterfaceUtopia Signal Recommendations Utopia Interface Example HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSSRXCLK1 HSSTXDATA1HSSTXCLK1 HSSRXDATA1HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface Input Pull Name Outpu Recommendations Down PCI InterfacePCI Controller Sheet 1 PCI Controller Sheet 2 PCI Interface Block DiagramPCI Interface Supporting 5 V PCI InterfacePCI Host/Option Interface Pin Description Sheet 1 PCI Option InterfacePCI Host/Option Interface Pin Description Sheet 2 PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockName Nominal Description Voltage PowerPower Interface Sheet 1 VCC De-Coupling Power SequenceReset Timing De-Coupling Capacitance RecommendationsHDD HDD Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsUSB Considerations Smii Signal ConsiderationsMII Signal Considerations EMI-Design Considerations Cross-TalkTrace Impedance Power and Ground PlaneHDD @66 MHz Electrical InterfaceTopology @33 MHzParameter Routing Guidelines Clock DistributionPCI Address/Data Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingDDRIDQS40 DDR Signal GroupsGroup Signal Name Description No of Single Ended Signals IntroductionDDR Sdram HDD Clock Banks Memory Size Supported Memory ConfigurationsVTT VTT Terminating Circuitry Selecting VTT Power SupplyDdrmclk DDR Command and Control Setup and Hold ValuesSymbol Parameter Min Max Units DDR Data to DQS Read Timing Parameters DDR Data to DQS Write Timing Parameters DDR-Data-to-DQS-Write Timing ParametersPrinted Circuit Board Layer Stackup Printed Circuit Board Layer Stackup Printed Circuit Board Controlled ImpedancePrinted Circuit Board Controlled Impedance Timing Relationships Signal Group Absolute Minimum Absolute Maximum LengthTiming Relationships Clock Group Resistive Compensation Register RcompDDRIBA10, DDRIRASN, DDRICASN, Ddriwen Clock Signal Group Routing GuidelinesData, Command, and Control Group Routing Guidelines Parameter DefinitionTransmission Line Length Clock Group Topology Transmission Line CharacteristicsSimulation Results Clock GroupDDR Clock Topology Two-Bank x16 Devices DDR Clock Simulation Results Two-Bank x16 Devices Data GroupData Group Topology Transmission Line Characteristics DDR Data Topology Two-Bank x16 Devices DDR Data Write Simulation Results Two-Bank x16 Devices HDD HDD Control Group Control Group Topology Transmission Line CharacteristicsDDR RAS Simulation Results Two-Bank x16 Devices Command Group Topology Transmission Line Characteristics Command GroupDDR Command MA3 Topology Two-Bank x16 Devices DDR Address Simulation Results Two-Bank x16 Devices DDR Command RAS Topology Two-Bank x16 Devices 104 DDR RCVENIN/RCVENOUT Topology Rcvenin and RcvenoutDDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω 108