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Intel® IXP45X and Intel® IXP46X Product Line of Network Processors—Category
Figure 28. Processor-DDR Interface
| DDRI_DQ[31:0] | DATA[31:0] | DQ[31:0] | |
Processors | DDRI_MA[13:0] | ADDRESS[13:0] | A[13:0] | |
DDRI_CK[2:0] | CLOCK[2:0], CLOCK#[2:0] | CK[2:0] | |
DDRI_CK_N[2:0] | CK#[2:0] | |
| |
DDRI_CKE[1:0] | CLOCK ENABLE[1:0] | CKE[1:0] | |
Line of Network | |
DDRI_CS_N[1:0] | CHIP SELECT#[1:0] | CS#[1:0] | DDR SDRAM |
DDRI_BA[1:0] | BANK SELECT[1:0] | BA[1:0] |
| | |
®Product | DDRI_CB[7:0] | ECC DATA[7:0] | DQ[7:0] | |
DDRI_DM[4:0] | DATA MASK[4:0] | DM[4:0] | |
Intel | DDRI_DQS[4:0] | DATA STROBE[4:0] | DQS[4:0] | |
| |
| DDRI_WE_N | | WE# | |
| DDRI_RAS_N | WRITE#, RAS#, CAS# | RAS# | |
| DDRI_CAS_N | | CAS# | |
| | | | B3986-001 |
Table 28 provides a list of supported memory configurations that can be implemented for one or two banks. Notice that depending on the number of devices used, loading of the driving signals is affected. The most critical signal affected by the loading is the DDRI_CK (clock output). This signal has a very strict timing requirement defined in the JEDEC standard, therefore signal integrity of this signal is a must. The following table shows how to assign the number of devices per clock line for the various configuration. It also suggest to use a DDR SSTL zero delay clock driver when more than two devices per clock line are connected. From Table 28, any time the word “driver” appears, it is meant to let designers know that for that particular configuration, a clock driver is required. One recommended clock driver can be the Pericom PI6CV855 or a similar device. The Pericom device is highly used in DIMM memory modules that required to deliver clocks to many devices in a single module.
The best approach is to minimize the number of devices used to get the target total memory size required by design.
Intel® IXP45X and Intel® IXP46X Product Line of Network Processors | |
HDD | February 2007 |
76 | Document Number: 305261, Revision: 004 |
Contents
Hardware Design Guidelines
February
HDD
Contents
12.1
Figures
Control Group Topology Transmission Line Characteristics
Tables
Revision History
Date Revision Description
HDD
Content Overview
Chapter Name Description
Related Documentation
Title Document #
List of Acronyms and Abbreviations
Overview
Term Explanation
Smii
Intel IXP465 Component Block Diagram
Typical Applications
Dslam
System Architecture Description
System Memory Map
Intel IXP465 Example System Block Diagram
Signal Type Definitions
Soft Fusible Features
Symbol Description
Signal Interface
Soft Fusible Features
DDR-266 Sdram Interface
DDR Sdram Interface Pin Description Sheet 1
DDR Sdram Interface Pin Description Sheet 2
Ddriwen
Ddrircveninn
Ddrircomp
DDR Sdram Memory Interface
Expansion Bus
DDR Sdram Initialization
Expansion Bus Signal Recommendations
Reset Configuration Straps
Input Pull Name Recommendations Output Down
Boot/Reset Strapping Configuration Sheet 1
Name Function Description
3 8-Bit Device Interface
Boot/Reset Strapping Configuration Sheet 2
4 16-Bit Device Interface
5 32-Bit Device Interface
Bit Device
16/32-Bit Device Interface Byte Enable
Flash Interface
Flash Interface Example
Sram Interface
Uart Interface
Design Notes
Uart Signal Recommendations
Name Input Pull Recommendations Output Down
MII/SMII Interface
Uart Interface Example
MII NPE a Signal Recommendations
Signal Interface MII
MII NPE B Signal Recommendations Sheet 1
MII NPE B Signal Recommendations Sheet 2
MII NPE C Signal Recommendations
Device Connection, MII
MAC Management Signal Recommendations NPE A,B,C
NPE A,B,C
Signal Interface, Smii
Smii Signal Recommendations NPE A, B, C
Gpio Interface
Device Connection, Smii
Gpio Signal Recommendations
I2C Interface
I2C Signal Recommendations
Device Connection
USB Interface
I2C Eeprom Interface Example
USB Host/Device Signal Recommendations
Host Device
Utopia Level 2 Interface
USB Device Interface Example
Utopia Signal Recommendations
HSS Interface
Utopia Interface Example
High-Speed, Serial Interface
HSSTXDATA0
HSSTXCLK0
HSSRXDATA0
HSSTXDATA1
HSSTXCLK1
HSSRXDATA1
HSSRXCLK1
SSP Interface
HSS Interface Example
Synchronous Serial Peripheral Port Interface
PCI Controller Sheet 1
PCI Interface
Input Pull Name Outpu Recommendations Down
PCI Interface Block Diagram
PCI Controller Sheet 2
Supporting 5 V PCI Interface
PCI Interface
PCI Option Interface
PCI Host/Option Interface Pin Description Sheet 1
PCI Host/Option Interface Pin Description Sheet 2
Jtag Interface
PCI Host/Option Interface Pin Description Sheet 3
Clock Signals
Clock Signals
Input System Clock
Clock Oscillator
Power Interface Sheet 1
Power
Name Nominal Description Voltage
Power Sequence
Reset Timing
De-Coupling Capacitance Recommendations
VCC De-Coupling
HDD
HDD
Component Placement
PCB Overview
General Recommendations
Component Selection
Component Placement on a PCB
Stack-Up Selection
Controlled-impedance traces Low-impedance power distribution
Layer Stackup
General Layout and Routing Guide
General Layout Guidelines
Signal Changing Reference Planes
General Component Spacing
Good Design Practice for VIA Hole Placement
Clock Signal Considerations
Pad-to-Pad Clearance of Passive Components to a PGA or BGA
MII Signal Considerations
Smii Signal Considerations
USB Considerations
Cross-Talk
EMI-Design Considerations
Power and Ground Plane
Trace Impedance
HDD
Electrical Interface
Topology
@33 MHz
@66 MHz
PCI Address/Data Routing Guidelines
Clock Distribution
Parameter Routing Guidelines
Trace Length Limits
PCI Clock Routing Guidelines
Signal Loading
Routing Guidelines
DDR Signal Groups
Group Signal Name Description No of Single Ended Signals
Introduction
DDRIDQS40
DDR Sdram
HDD
Supported Memory Configurations
Clock Banks Memory Size
VTT
Selecting VTT Power Supply
VTT Terminating Circuitry
Symbol Parameter Min Max Units
DDR Command and Control Setup and Hold Values
Ddrmclk
DDR Data to DQS Read Timing Parameters
DDR-Data-to-DQS-Write Timing Parameters
DDR Data to DQS Write Timing Parameters
Printed Circuit Board Layer Stackup
Printed Circuit Board Controlled Impedance
Printed Circuit Board Layer Stackup
Printed Circuit Board Controlled Impedance
Timing Relationships
Signal Group Absolute Minimum Absolute Maximum Length
Timing Relationships
Resistive Compensation Register Rcomp
Clock Group
Clock Signal Group Routing Guidelines
Data, Command, and Control Group Routing Guidelines
Parameter Definition
DDRIBA10, DDRIRASN, DDRICASN, Ddriwen
Clock Group Topology Transmission Line Characteristics
Simulation Results
Clock Group
Transmission Line Length
DDR Clock Topology Two-Bank x16 Devices
Data Group
DDR Clock Simulation Results Two-Bank x16 Devices
Data Group Topology Transmission Line Characteristics
DDR Data Topology Two-Bank x16 Devices
DDR Data Write Simulation Results Two-Bank x16 Devices
HDD
HDD
Control Group Topology Transmission Line Characteristics
Control Group
DDR RAS Simulation Results Two-Bank x16 Devices
Command Group
Command Group Topology Transmission Line Characteristics
DDR Command MA3 Topology Two-Bank x16 Devices
DDR Address Simulation Results Two-Bank x16 Devices
DDR Command RAS Topology Two-Bank x16 Devices
104
Rcvenin and Rcvenout
DDR RCVENIN/RCVENOUT Topology
DDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω
DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω
108