Intel IXP45X, IXP46X manual Introduction, DDR Signal Groups, DDRIDQS40, DDRICKE10

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DDR-SDRAM—Intel®IXP45X and Intel® IXP46X Product Line of Network Processors

7.0DDR-SDRAM

7.1Introduction

This document is intended to be used as a guide for routing DDR, based on the Intel® IXDP465 Development Platform. It contains routing guidelines and simulation results for using x16 Thin Small Outline Package (TSOP) memory devices soldered onto the processor module.

As shown in Figure 28, the Intel® IXP45X and Intel® IXP46X Product Line of Network Processors support two banks of 32-bit wide non-Error Correcting Code (non-ECC) or 40-bit wide (ECC) DDR-266 memory with the ability for single-bit error correction or multi-bit error detection (ECC). The IXP45X/IXP46X network processors support un- buffered DRAM only in densities of 128/256/512 Mbit or 1 Gbit. Table 27 lists the signal groups used for the DDR interface.

In this document, the term IXP45X/IXP46X product line refers to both the IXP46X network processors (with DDR ECC) and IXP45X network processors (without DDR ECC).

Table 27.

DDR Signal Groups

 

 

 

 

 

 

 

 

Group

Signal Name

Description

No of Single

 

Ended Signals

 

 

 

 

 

 

 

 

 

 

Clocks

DDRI_CK[2:0]

DDR-SDRAM Differential Clocks

0

 

 

 

 

 

DDRI_CK_N[2:0]

DDR-SDRAM Inverted Differential Clocks

0

 

 

 

 

 

 

 

 

 

DDRI_CB[7:0]

ECC Data

8

 

 

 

 

 

 

Data

DDRI_DQ[31:0]

Data Bus

32

 

 

 

 

 

DDRI_DQS[4:0]

Data Strobes

5

 

 

 

 

 

 

 

 

 

DDRI_DM[4:0]

Data Mask

5

 

 

 

 

 

 

Control

DDRI_CKE[1:0]

Clock Enable - one per bank

2

 

 

 

 

 

DDRI_CS_N[1:0]

Chip Select - one per bank

2

 

 

 

 

 

 

 

 

 

DDRI_MA[13:0]

Address Bus

14

 

 

 

 

 

 

 

DDRI_BA[1:0]

Bank Select

2

 

 

 

 

 

 

Command

DDRI_RAS_N

Row Address Select

1

 

 

 

 

 

 

 

DDRI_CAS_N

Column Address Select

1

 

 

 

 

 

 

 

DDRI_WE_N

Write Enable

1

 

 

 

 

 

 

 

 

Total

73

 

 

 

 

 

 

Intel® IXP45X and Intel® IXP46X Product Line of Network Processors

February 2007

HDD

Document Number: 305261, Revision: 004

75

Image 75
Contents February Hardware Design GuidelinesHDD Contents 12.1 Figures Tables Control Group Topology Transmission Line CharacteristicsDate Revision Description Revision HistoryHDD Chapter Name Description Content OverviewTitle Document # Related DocumentationOverview List of Acronyms and AbbreviationsTerm Explanation Smii Intel IXP465 Component Block Diagram Dslam Typical ApplicationsSystem Memory Map System Architecture DescriptionIntel IXP465 Example System Block Diagram Soft Fusible Features Signal Type DefinitionsSymbol Description DDR Sdram Interface Pin Description Sheet 1 Signal InterfaceSoft Fusible Features DDR-266 Sdram InterfaceDdrircomp DDR Sdram Interface Pin Description Sheet 2Ddriwen DdrircveninnExpansion Bus DDR Sdram Memory InterfaceDDR Sdram Initialization Reset Configuration Straps Expansion Bus Signal RecommendationsInput Pull Name Recommendations Output Down Name Function Description Boot/Reset Strapping Configuration Sheet 1Boot/Reset Strapping Configuration Sheet 2 3 8-Bit Device Interface4 16-Bit Device Interface 5 32-Bit Device Interface Bit Device 16/32-Bit Device Interface Byte Enable Flash Interface Example Flash InterfaceUart Interface Sram InterfaceDesign Notes Name Input Pull Recommendations Output Down Uart Signal RecommendationsUart Interface Example MII/SMII InterfaceSignal Interface MII MII NPE a Signal RecommendationsMII NPE B Signal Recommendations Sheet 1 MII NPE C Signal Recommendations MII NPE B Signal Recommendations Sheet 2MAC Management Signal Recommendations NPE A,B,C Device Connection, MIINPE A,B,C Smii Signal Recommendations NPE A, B, C Signal Interface, SmiiDevice Connection, Smii Gpio InterfaceGpio Signal Recommendations I2C Signal Recommendations I2C InterfaceDevice Connection I2C Eeprom Interface Example USB InterfaceUSB Host/Device Signal Recommendations Host Device USB Device Interface Example Utopia Level 2 InterfaceUtopia Signal Recommendations Utopia Interface Example HSS InterfaceHSSRXDATA0 High-Speed, Serial InterfaceHSSTXDATA0 HSSTXCLK0HSSRXCLK1 HSSTXDATA1HSSTXCLK1 HSSRXDATA1HSS Interface Example SSP InterfaceSynchronous Serial Peripheral Port Interface PCI Interface PCI Controller Sheet 1Input Pull Name Outpu Recommendations Down PCI Controller Sheet 2 PCI Interface Block DiagramPCI Interface Supporting 5 V PCI InterfacePCI Host/Option Interface Pin Description Sheet 1 PCI Option InterfacePCI Host/Option Interface Pin Description Sheet 2 PCI Host/Option Interface Pin Description Sheet 3 Jtag InterfaceClock Oscillator Clock SignalsClock Signals Input System ClockPower Power Interface Sheet 1Name Nominal Description Voltage VCC De-Coupling Power SequenceReset Timing De-Coupling Capacitance RecommendationsHDD HDD Component Selection Component PlacementPCB Overview General RecommendationsStack-Up Selection Component Placement on a PCBControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout Guidelines General Layout and Routing GuideGeneral Component Spacing Signal Changing Reference PlanesGood Design Practice for VIA Hole Placement Pad-to-Pad Clearance of Passive Components to a PGA or BGA Clock Signal ConsiderationsSmii Signal Considerations MII Signal ConsiderationsUSB Considerations EMI-Design Considerations Cross-TalkTrace Impedance Power and Ground PlaneHDD @66 MHz Electrical InterfaceTopology @33 MHzClock Distribution PCI Address/Data Routing GuidelinesParameter Routing Guidelines PCI Clock Routing Guidelines Trace Length LimitsRouting Guidelines Signal LoadingDDRIDQS40 DDR Signal GroupsGroup Signal Name Description No of Single Ended Signals IntroductionDDR Sdram HDD Clock Banks Memory Size Supported Memory ConfigurationsVTT VTT Terminating Circuitry Selecting VTT Power SupplyDDR Command and Control Setup and Hold Values Symbol Parameter Min Max UnitsDdrmclk DDR Data to DQS Read Timing Parameters DDR Data to DQS Write Timing Parameters DDR-Data-to-DQS-Write Timing ParametersPrinted Circuit Board Layer Stackup Printed Circuit Board Layer Stackup Printed Circuit Board Controlled ImpedancePrinted Circuit Board Controlled Impedance Signal Group Absolute Minimum Absolute Maximum Length Timing RelationshipsTiming Relationships Clock Group Resistive Compensation Register RcompDDRIBA10, DDRIRASN, DDRICASN, Ddriwen Clock Signal Group Routing GuidelinesData, Command, and Control Group Routing Guidelines Parameter DefinitionTransmission Line Length Clock Group Topology Transmission Line CharacteristicsSimulation Results Clock GroupDDR Clock Topology Two-Bank x16 Devices DDR Clock Simulation Results Two-Bank x16 Devices Data GroupData Group Topology Transmission Line Characteristics DDR Data Topology Two-Bank x16 Devices DDR Data Write Simulation Results Two-Bank x16 Devices HDD HDD Control Group Control Group Topology Transmission Line CharacteristicsDDR RAS Simulation Results Two-Bank x16 Devices Command Group Topology Transmission Line Characteristics Command GroupDDR Command MA3 Topology Two-Bank x16 Devices DDR Address Simulation Results Two-Bank x16 Devices DDR Command RAS Topology Two-Bank x16 Devices 104 DDR RCVENIN/RCVENOUT Topology Rcvenin and RcvenoutDDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω 108