Intel IXP46X, IXP45X manual Host Device

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Intel® IXP45X and Intel® IXP46X Product Line of Network Processors—General Hardware Design Considerations

To maintain signal integrity and minimize end-users termination mismatch, the IXP45X/IXP46X network processors require external series termination resistors. The value of terminating resistors is based on the operational speed and length of the transmission line. It is recommended to start with a 18-Ωresistor and adjust the value if required.

Note: In Figure 11, the series termination for the Host port is 20 Ω, however, Figure 12 recommends using 18 Ω for the Device port.

3.8.2Device Connection

Figure 11. USB Host Down Stream Interface Example

		USB_VDD
Host					Device
Intel® IXP46X
Product Line
Network Processor			200 mA
		FERRITE		V_BUS	USB_3V3
		47 µF		V_BUS	USB_3V3
		47 µF
USB_HPEN		0.1 µF	0.1 µF
USB_HPEN		4.7 µF			1.5 KΩ
		4.7 µF			1.5 KΩ
USB_HPWR					Look at
					Note 1&2
USB_HPOS	20 Ω		FERRITE		D
USB_HPOS					D
(D+)					+	Device
(D+)					+

	USB	15 KΩ	22 pF 22 pF		D-
	USB	15 KΩ
	Port
USB_HNEG	20 Ω
(D-)			FERRITE
		15 KΩ	22 pF 22 pF
		15 KΩ
						B4105-002

Intel® IXP45X and Intel® IXP46X Product Line of Network Processors
HDD	February 2007
40	Document Number: 305261; Revision: 004

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Contents Hardware Design Guidelines FebruaryHDD Contents 12.1 Figures Control Group Topology Transmission Line Characteristics TablesRevision History Date Revision DescriptionHDD Content Overview Chapter Name DescriptionRelated Documentation Title Document #List of Acronyms and Abbreviations OverviewTerm Explanation Smii Intel IXP465 Component Block Diagram Typical Applications DslamSystem Architecture Description System Memory MapIntel IXP465 Example System Block Diagram Signal Type Definitions Soft Fusible FeaturesSymbol Description Signal Interface Soft Fusible FeaturesDDR-266 Sdram Interface DDR Sdram Interface Pin Description Sheet 1DDR Sdram Interface Pin Description Sheet 2 DdriwenDdrircveninn DdrircompDDR Sdram Memory Interface Expansion BusDDR Sdram Initialization Expansion Bus Signal Recommendations Reset Configuration StrapsInput Pull Name Recommendations Output Down Boot/Reset Strapping Configuration Sheet 1 Name Function Description3 8-Bit Device Interface Boot/Reset Strapping Configuration Sheet 24 16-Bit Device Interface 5 32-Bit Device Interface Bit Device 16/32-Bit Device Interface Byte Enable Flash Interface Flash Interface ExampleSram Interface Uart InterfaceDesign Notes Uart Signal Recommendations Name Input Pull Recommendations Output DownMII/SMII Interface Uart Interface ExampleMII NPE a Signal Recommendations Signal Interface MIIMII NPE B Signal Recommendations Sheet 1 MII NPE B Signal Recommendations Sheet 2 MII NPE C Signal RecommendationsDevice Connection, MII MAC Management Signal Recommendations NPE A,B,CNPE A,B,C Signal Interface, Smii Smii Signal Recommendations NPE A, B, CGpio Interface Device Connection, SmiiGpio Signal Recommendations I2C Interface I2C Signal RecommendationsDevice Connection USB Interface I2C Eeprom Interface ExampleUSB Host/Device Signal Recommendations Host Device Utopia Level 2 Interface USB Device Interface ExampleUtopia Signal Recommendations HSS Interface Utopia Interface ExampleHigh-Speed, Serial Interface HSSTXDATA0HSSTXCLK0 HSSRXDATA0HSSTXDATA1 HSSTXCLK1HSSRXDATA1 HSSRXCLK1SSP Interface HSS Interface ExampleSynchronous Serial Peripheral Port Interface PCI Controller Sheet 1 PCI InterfaceInput Pull Name Outpu Recommendations Down PCI Interface Block Diagram PCI Controller Sheet 2Supporting 5 V PCI Interface PCI InterfacePCI Option Interface PCI Host/Option Interface Pin Description Sheet 1PCI Host/Option Interface Pin Description Sheet 2 Jtag Interface PCI Host/Option Interface Pin Description Sheet 3Clock Signals Clock SignalsInput System Clock Clock OscillatorPower Interface Sheet 1 PowerName Nominal Description Voltage Power Sequence Reset TimingDe-Coupling Capacitance Recommendations VCC De-CouplingHDD HDD Component Placement PCB OverviewGeneral Recommendations Component SelectionComponent Placement on a PCB Stack-Up SelectionControlled-impedance traces Low-impedance power distribution Layer Stackup General Layout and Routing Guide General Layout GuidelinesSignal Changing Reference Planes General Component SpacingGood Design Practice for VIA Hole Placement Clock Signal Considerations Pad-to-Pad Clearance of Passive Components to a PGA or BGAMII Signal Considerations Smii Signal ConsiderationsUSB Considerations Cross-Talk EMI-Design ConsiderationsPower and Ground Plane Trace ImpedanceHDD Electrical Interface Topology@33 MHz @66 MHzPCI Address/Data Routing Guidelines Clock DistributionParameter Routing Guidelines Trace Length Limits PCI Clock Routing GuidelinesSignal Loading Routing GuidelinesDDR Signal Groups Group Signal Name Description No of Single Ended SignalsIntroduction DDRIDQS40DDR Sdram HDD Supported Memory Configurations Clock Banks Memory SizeVTT Selecting VTT Power Supply VTT Terminating CircuitrySymbol Parameter Min Max Units DDR Command and Control Setup and Hold ValuesDdrmclk DDR Data to DQS Read Timing Parameters DDR-Data-to-DQS-Write Timing Parameters DDR Data to DQS Write Timing ParametersPrinted Circuit Board Layer Stackup Printed Circuit Board Controlled Impedance Printed Circuit Board Layer StackupPrinted Circuit Board Controlled Impedance Timing Relationships Signal Group Absolute Minimum Absolute Maximum LengthTiming Relationships Resistive Compensation Register Rcomp Clock GroupClock Signal Group Routing Guidelines Data, Command, and Control Group Routing GuidelinesParameter Definition DDRIBA10, DDRIRASN, DDRICASN, DdriwenClock Group Topology Transmission Line Characteristics Simulation ResultsClock Group Transmission Line LengthDDR Clock Topology Two-Bank x16 Devices Data Group DDR Clock Simulation Results Two-Bank x16 DevicesData Group Topology Transmission Line Characteristics DDR Data Topology Two-Bank x16 Devices DDR Data Write Simulation Results Two-Bank x16 Devices HDD HDD Control Group Topology Transmission Line Characteristics Control GroupDDR RAS Simulation Results Two-Bank x16 Devices Command Group Command Group Topology Transmission Line CharacteristicsDDR Command MA3 Topology Two-Bank x16 Devices DDR Address Simulation Results Two-Bank x16 Devices DDR Command RAS Topology Two-Bank x16 Devices 104 Rcvenin and Rcvenout DDR RCVENIN/RCVENOUT TopologyDDR RCVENIN/RCVENOUT Simulation Results Rseries = 0 Ω DDR RCVENIN/RCVENOUT Simulation Results Rseries = 60 Ω 108