Texas Instruments specifications TNETX4090GGP Obsolete BGA, Tbd

Page 77

PACKAGE OPTION ADDENDUM

www.ti.com

4-May-2009

 

 

PACKAGING INFORMATION

Orderable Device

Status (1)

Package

Package

Pins Package

Eco Plan (2)

Lead/Ball Finish

MSL Peak Temp (3)

 

 

Type

Drawing

Qty

 

 

 

TNETX4090GGP

OBSOLETE

BGA

GGP

352

TBD

Call TI

Call TI

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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Contents Description MAC MII MIIMAC Eeprom CPU I/F DMAPCS Duplex LED Rdram Interface Jtag Interface GGP Package Bottom View Signal Ball Name Signal-to-Ball Mapping Signal Names Sorted AlphabeticallyReset Sdma SAD0 Jtag interface Terminal FunctionsControl logic interface Terminal Internal Description Name RESISTOR²M08TXD7 M08TXD6 M08TXD5 100-/1000-Mbit/s MAC interface Gmii modeTerminal Internal Description Name Resistor Port to not support pause frames Pulldown 10-/100-Mbit/s MAC interface MII mode ports 0±7M00RENEG M01RENEG M04TCLK M05TCLK M06TCLK M07TCLK AD4 ThunderSWITCH II 9-PORT 100-/1000-MBIT/S ETHERNET SwitchMII management interface Rdram interface Eeprom interface DIO interface100-/1000-Mbit/s port PCS LED interface Power supplyLED interface Byte DIO Address DIO interface descriptionDIO Internal Register Address Map TNETX4090 ThunderSWITCH II 9-PORT 100-/1000-MBIT/S ETHERNETVLAN1QID VLAN0QID VLAN37QID VLAN36QID TNETX4090 PCS8Status PCS8Control 0x0700 DIO interface description Port no Head Statistic Even ODD Ports Port StatisticsTail 0x90Ex Port no Head Statistic TailSignal Description DMA Interface SignalsAddress-Lookup Statistics Receiving/transmitting management framesDIO Interface During Hardware Reset State of DIO signal terminals during hardware resetDIO Interface State During Hardware Reset Ieee Std 802.1Q Vlan tags on the NM portFCS Vlan IDTpid TCI CRCTNETX4090 Full-duplex NM port PHY management interfaceNM bandwidth and priority Interrupt processingMAC interface Interframe gap enforcement Adaptive performance optimization APOBackoff Receive versus transmit prioritySpeed, duplex, and flow-control negotiation 10-/100-Mbit/s MII ports 0±7100-Mbit/s Port Negotiation With the TNETE2104 100-/1000-Mbit/s PHY interface port Port 8 Pause Negotiation in MII Mode Port 8 Duplex Negotiation in MII ModeFull-duplex hardware flow control OutcomeM08GTCLK M08TXEN Pretagging and extended port awarenessPretag on transmission Pretag on reception Transmit Pretag Bit DefinitionsLearning Format Receive Pretag Bit Definitions BIT Name FunctionRing-cascade topology Directed Format Receive Pretag Bit DefinitionsRXD Flow COL TXD TNETX4090 RXD Flow COL TXDM08GTCLK M08TXEN M08RXDV Switch TerminalRing-Topology Connectivity GND SCL SDAEdio TNETX4090 Eclk Summary of Eeprom load outcomes Outcome Stop Load Initd ² Fault LED EclkInteraction of Eeprom load with the SIO register Port LED States Compatibility with future device revisionsCollision LED States State DisplayLED Status Bit Definitions and Shift Order PCS duplex LEDLamp test Multi-LED displayBUS Enable GND Rdram BUS Ctrl SIN BUS Enable GND BUS Ctrl Rdram SINTNETX4090 VCC NC Txclk Vref Rxclk VDD Sout SCHAIN0 Txclk Vref Rxclk VDDHighz instruction Jtag Instruction OpcodesRacbist instruction Jtag Bist StatusIale Frame routingVlan support Ieee Std 802.1Q tags ± reception Address maintenanceIeee Std 802.1Q header ± transmission Spanning-tree supportAging algorithms Frame-Routing Algorithm SPWS044E ± December 1997 ± Revised August Port routing code Removal of source port Port trunking/load sharingTrunk Group 0 Port Membership Trunk0Ports Register Port trunking exampleTrunk Group 1 Port Membership Trunk1Ports Register Extended port awarenessFlow control Hardware flow control Other flow-control mechanismsMulticast limit System test capabilitiesInternal wrap test Reading RdramPHY TNETX4090 Duplex wrap testMIN NOM MAX Unit Recommended operating conditionsTiming requirements over recommended operating conditions Jtag interface Control signalsReset see Figure PMA receive see Figure Physical medium attachment interface port ReceivePMA transmit see Figure TransmitGmii transmit see Figure Gmii portGmii receive see Figure Gmii Clock PMA and Gmii clock see FigureMII receive see Figure MII ports 0±8MII clock see Figure MII transmit see FigureRdram see Figure Rdram interfaceDtxclk Drxclk Dbusctrl DbusenSCS Srnw SAD1±SAD0 Sdma SDATA7± SDATA0 Srdy Sint DIO interfaceDIO and DMA writes see Figure SCS Srnw SAD1±SAD0 Sdma SDATA7± SDATA0 Srdy DIO and DMA reads see FigureEeprom reads see Figure Eeprom interfaceEeprom writes see Figure Ledclk Leddata LED interfaceLED see Figure VOL VOHTTL Output Macro Propagation-Delay-Time Voltage Waveforms VOL VDD VDD VOH50% Lvcmos Mechanical Data TBD TNETX4090GGP Obsolete BGAImportant Notice
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