AMD LX 600@0.7W, LX 700@0.8W, LX 800@0.9W, LX 900@1.5W 1.2 Features

12 AMD Geode™ LX Processors Data Book
Overview
33234H
1.2 Features
General Features
■Functional blocks include:
—CPU Core
— GeodeLink™ Control Processor
— GeodeLink Interface Units
— GeodeLink Memory Controller
— Graphics Processor
— Display Controller
— Video Processor
– TFT Controller/Video Output Port
— Video Input Port
— GeodeLink PCI Bridge
— Security Block
■0.13 micron process
■Packaging:
— 481-Terminal BGU (Ball Grid Array Cavity Up) with
internal heatspreader
■Single packaging option supports all features
■Industrial temperature range available for the
LX 800@0.9W processor*
CPU Processor Features
■x86/x87-compatible CPU core
■Performance:
— Processor frequency: up to 600 MHz
— Dhrystone 2.1 MIPs: 150 to 450
— Fully pipelined FPU
■Split I/D cache/TLB (Translation Look-aside Buffer):
— 64 KB I-cache/64 KB D-cache
— 128 KB L2 cache configurable as I-cache, D-cache,
or both
■Efficient prefetch and branch prediction
■Integrated FPU that supports the MMX™ and
AMD 3DNow!™ instruction sets
■Fully pipelined single precision FPU hardware with
microcode support for higher precisions
GeodeLink™ Control Processor
■JTAG interface:
— ATPG, Full Scan, BIST on all arrays
— 1149.1 Boundary Scan compliant
■ICE (in-circuit emulator) interface
■Reset and clock control
■Designed for improved software debug methods and
performance analysis
■Power Management:
— LX 900@1.5W processor* (Unterminated):
Total Dissipated Power (TDP) 5.1W,
2.6W typical @ 600 MHz max power
— LX 800@0.9W processor* (Unterminated):
Total Dissipated Power (TDP) 3.6W,
1.8W typical @ 500 MHz max power
— LX 700@0.8W processor* (Unterminated):
Total Dissipated Power (TDP) 3.1W,
1.3W typical @ 433 MHz max power
— LX 600@0.7W processor* (Unterminated):
Total Dissipated Power (TDP) 2.8W,
1.2W typical @ 366 MHz max power
— GeodeLink active hardware power management
— Hardware support for standard ACPI software power
management
— I/O companion SUSP/SUSPA power controls
— Lower power I/O
— Wakeup on SMI/INTR
■Works in conjunction with the AMD Geode™ CS5536
(USB 2.0) or CS5535 (USB 1.1) companion device
GeodeLink™ Architecture
■High bandwidth packetized uni-directional bus for
internal peripherals
■Standardized protocol to allow variants of products to be
developed by adding or removing modules
■GeodeLink Control Processor (GLCP) for diagnostics
and scan control
■Dual GeodeLink Interface Units (GLIUs) for device inter-
connect
GeodeLink™ Memory Controller
■Integrated memory controller for low latency to CPU and
on-chip peripherals
■64-bit wide DDR SDRAM bus operating frequency:
— 200 MHz, 400 MT/S
■Supports unbuffered DDR DIMMS using up to 2 GB
DRAM technology
■Supports up to 2 DIMMS (16 devices max)
2D Graphics Processor
■High performance 2D graphics controller
■Alpha BLT
■Windows® GDI GUI acceleration:
— Hardware support for all Microsoft RDP codes
■Command buffer interface for asynchronous BLTs
■Second pattern channel support
■Hardware screen rotation
*The AMD Geode LX 900@1.5W processor operates at 600 MHz, the AMD Geode LX 800@0.9W processor operates at 500 MHz, the
AMD Geode LX 700@0.8W processor operates at 433 MHz and the AMD Geode LX 600@.07W processor operates at 366 MHz. Model
numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark.