Package Specifications

32580B

10.2Physical Dimensions

The figures in this section provide the mechanical package outlines for the BGU481 (Thermally Enhanced Ball Grid Array) package.

Figure 10-2. BGU481 Package - Top View

AMD Geode™ SC2200 Processor Data Book

445

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AMD manual Physical Dimensions, Package Specifications, AMD Geode SC2200 Processor Data Book 445