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Motorola MC9S12C-Family, MC9S12GC-Family warranty Table B-9 NVM Reliability Characteristics

Models: MC9S12C-Family MC9S12GC-Family

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Device User Guide — 9S12C128DGV1/D V01.05

B.5.2 NVM Reliability

The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors and burn-in to screen early life failures.

The failure rates for data retention and program/erase cycling are specified at <2ppm defects over lifetime at the operating conditions noted.

A program/erase cycle is specified as two transitions of the cell value from erased → programmed → erased, 1 → 0 → 1.

NOTE: All values shown in Table B-9 are target values and subject to further extensive characterization.

Table B-9 NVM Reliability Characteristics

Conditions are shown in Table A-4 unless otherwise noted

Num	C	Rating	Symbol	Min	Typ	Max	Unit

1	C	Data Retention at an average junction temperature of	tNVMRET	15			Years
1	C	TJavg = 85°C	tNVMRET	15			Years
		TJavg = 85°C
2	C	Flash number of Program/Erase cycles	nFLPE	10,000			Cycles

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Motorola MC9S12C-Family, MC9S12GC-Family warranty Table B-9 NVM Reliability Characteristics

Contents

Document Number 9S12C128DGV1/D Device User Guide 9S12C128DGV1/D Revision HistoryTable of Contents System Clock Description Modes of Operation Resets and InterruptsVoltage Regulator Vreg Block Description HCS12 Core Block DescriptionAppendix B Electrical Specifications Appendix E Emulation Information Appendix C Electrical SpecificationsAppendix D Package Information Device User Guide 9S12C128DGV1/D List of Figures Device User Guide 9S12C128DGV1/D List of Tables Device User Guide 9S12C128DGV1/D Device User Guide 9S12C128DGV1/D Device User Guide 9S12C128DGV1/D Package Device Part Number Mask Temp Flash PrefaceList of MC9S12C and MC9S12GC Family members MC9S12C-Family Package Option SummaryTBD 48LQFP Speed Options 25 = 25MHz bus 16 = 16MHz busPart Number Mask Temp Package Speed Description Set MC9S12C96PVFA16 MC9S12C96PCFA16MC9S12C96PCPB16 MC9S12C96PCFU16MC9S12C64PCFA16 MC9S12C96PMFA25MC9S12C96PMPB25 MC9S12C96PMFU25MC9S12GC-Family Part Number Coding MC9S12GC64PVFA25 MC9S12GC64CFA25 TBDMC9S12GC64CPB25 TBD MC9S12GC64CFU25 TBDUser Guide Version Document Order Number TerminologyDocument References Device User Guide 9S12C128DGV1/D Overview FeaturesIntroduction Device User Guide 9S12C128DGV1/D Modes of Operation Special Test ModeMotorola use only MC9S12C-Family Block Diagram Block DiagramAddress Module Size Device Memory MapDevice Register Map Overview MC9S12C128 and MC9S12GC128 User configurable Memory Map MC9S12C96 User Configurable Memory Map MC9S12C64 and MC9S12GC64 User Configurable Memory Map MC9S12C32 and MC9S12GC32 User Configurable Memory Map Detailed Register Map MC9S12GC16 User Configurable Memory MapIvis $0010 $0014 MMC map 1 of 4 HCS12 Module Mapping ControlMiscellaneous Peripherals Device User Guide $0015 $0016 INT map 1 of 2 HCS12 Interrupt$0017 $0017 MMC map 2 of 4 HCS12 Module Mapping Control $0018 $0018$0020 $002F DBG including BKP map 1 of 1 HCS12 Debug $001F $001F INT map 2 of 2 HCS12 Interrupt$0030 $0031 MMC map 4 of 4 HCS12 Module Mapping Control $0034 $003F CRG Clock and Reset Generator$0040 $006F TIM Timer 16 Bit 8 Channels $0050 $0070 $007F Reserved $00A0 $00C7TIE $00C8 $00CF SCI Asynchronous Serial Interface$00D0 $00D7 Reserved $00D8 $00DF SPI Serial Peripheral Interface$00E0 $00FF PWM Pulse Width Modulator $0100 $010F Flash Control Register Time $0110 $013F$0140 $017F Reserved Can Motorola Scalable can MSCAN1 $0140 $017F Can Motorola Scalable can MSCAN1 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0 $0180 $023FReserved $0240 $027F PIM Port Interface Module PRIO7 PRIO6 PRIO5 PRIO4 PRIO3 PRIO2 PRIO1 PRIO0Ptis DDRAD2 PTAD7 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0PTIAD7 PTIAD6 PTIAD5 PTIAD4 PTIAD3 PTIAD2 PTIAD1 PTIJ7 DDRAD7Memory size registers Part ID Assignments$0280 $03FF Reserved space Assigned Part ID NumbersMC9S12C32, MC9S12GC32 Device Pinout Signal DescriptionPW4/IOC4/PT4 PW0/IOC0/PT0 PW1/IOC1/PT1 PW2/IOC2/PT2 PW3/IOC3/PT3Pin Assignments in 48 Lqfp for MC9S12C-Family Resistor Description Function Domain Signal Properties SummarySignal Properties Internal PullDevice User Guide 9S12C128DGV1/D Internal Pull Pin Name Pin Initialization for 48 & 52 Pin Lqfp bond-out versionsTest / VPP Test Pin Detailed Signal DescriptionsEXTAL, Xtal Oscillator Pins Reset External Reset Pin8 PE7 / Noacc / Xclks Port E I/O Pin Bkgd / Taghi / Modc Background Debug, Tag High & Mode Pin6 PA70 / ADDR158 / DATA158 Port a I/O Pins 7 PB70 / ADDR70 / DATA70 Port B I/O PinsPierce Oscillator Connections PE7=0 Colpitts Oscillator Connections PE7=112 PE3 / Lstrb Port E I/O Pin 3 / Low-Byte Strobe Lstrb 9 PE6 / Modb / IPIPE1 Port E I/O Pin10 PE5 / Moda / IPIPE0 Port E I/O Pin 11 PE4 / ECLK- Port E I/O Pin 4 / E-Clock Output18 PP6 / KWP6/ROMCTL Port P I/O Pin 16 PAD70 / AN70 Port AD I/O Pins14 PE1 / IRQ Port E input Pin 1 / Maskable Interrupt Pin 17 PP7 / KWP7 Port P I/O Pin22 PM4 / Mosi Port M I/O Pin 19 PP50 / KWP50 / PW50 Port P I/O Pins20 PJ76 / KWJ76 Port J I/O Pins 21 PM5 / SCK Port M I/O PinPower Supply Pins MC9S12C-Family Power and Ground Connection Summary VDDA, Vssa Power Supply Pins for ATD and Vreg5 VRH, VRL ATD Reference Voltage Input Pins VDDPLL, Vsspll Power Supply Pins for PLLModes of Operation Chip Configuration SummaryClock Selection Based on PE7 Mode SelectionSecurity Unsecuring the Microcontroller Low Power ModesSecuring the Microcontroller Operation of the Secured MicrocontrollerVectors Resets and InterruptsResets Device-specific information Reset Summary TableEffects of Reset HCS12 Core Block DescriptionDevice Specific Flash page Mapping Device Visible with Ppage contentsBDM alternate clock Extended Address Range Emulation Implications2 VDD1, VDD2, VSS1, VSS2 Voltage Regulator Vreg Block DescriptionRecommended Printed Circuit Board Layout VregenComponent Purpose Type Value Recommended External Component ValuesRecommended PCB Layout 48 Lqfp Recommended PCB Layout 52 Lqfp VSS2 Recommended PCB Layout 80 QFPRecommended PCB Layout for 48 Lqfp Pierce Oscillator Recommended PCB Layout for 52 Lqfp Pierce Oscillator Recommended PCB Layout for 80QFP Pierce Oscillator Clock Reset Generator CRG Block DescriptionSerial Communications Interface SCI Block Description Timer TIM Block DescriptionOscillator OSC Block Description Analog to Digital Converter ATD Block DescriptionMscan Block Description Flash Block DescriptionRAM Block Description Pulse Width Modulator PWM Block DescriptionDevice User Guide 9S12C128DGV1/D Parameter Classification Appendix a Electrical CharacteristicsPower Supply GeneralCurrent Injection PinsTable A-1 Absolute Maximum Ratings Num Rating Symbol Min Max UnitAbsolute Maximum Ratings Operating Conditions Table A-3 ESD and Latch-Up Protection CharacteristicsModel Description Symbol Value Unit ESD Protection and Latch-up ImmunityTable A-4 Operating Conditions Power Dissipation and Thermal CharacteristicsRating Symbol Min Typ Max Unit Pint = IDD ⋅ VDD + Iddpll ⋅ Vddpll + Idda ⋅ Vdda Num Rating Symbol Min Typ Max Unit 9 I/O CharacteristicsTable A-5 Thermal Package Characteristics1 Table A-6 5V I/O Characteristics Num Rating Symbol Min Typ Table A-7 3.3V I/O CharacteristicsAdditional Remarks Supply CurrentsMeasurement Conditions Table A-8 Supply Current Characteristics for MC9S12C32 Stop Current 40 C 27 C Table B-1 Voltage Regulator Electrical Parameters Appendix B Electrical SpecificationsCharacteristic Symbol Min Typical Max Unit Voltage Regulator Operating ConditionsLVI Chip Power-up and LVI/LVR graphical explanationOutput Loads Resistive LoadsTable B-2 Voltage Regulator Capacitive Loads Num Characteristic Symbol Min Typical Max UnitCapacitive Loads Device User Guide 9S12C128DGV1/D Table B-3 ATD Operating Characteristics ATD CharacteristicsATD Operating Characteristics In 5V Range ATD Operating Characteristics In 3.3V RangeSource capacitance Table B-4 ATD Operating CharacteristicsFactors influencing accuracy Source ResistanceCurrent injection Table B-5 ATD Electrical CharacteristicsTable B-7 ATD Conversion Performance ATD accuracy 5V RangeATD accuracy 3.3V Range Table B-6 ATD Conversion Performance1LSB Figure B-2 ATD Accuracy Definitions Row Programming NVM, Flash and EepromNVM timing Single Word ProgrammingMass Erase Table B-8 NVM Timing CharacteristicsSector Erase NVM Reliability Table B-9 NVM Reliability Characteristics108 Startup Reset, Oscillator and PLLOscillator External ResetStop Recovery Pseudo Stop and Wait RecoveryXFC Component Selection Phase Locked LoopTable B-11 Oscillator Characteristics XFC Pin Figure B-3 Basic PLL functional diagramJitter Information ⋅ synr += max ⎜ ⋅ t nom Table B-12 PLL Characteristics 116 Num Rating Symbol Min Typ Max Table B-13 Mscan Wake-up Pulse Characteristics118 Description Value Unit Appendix C Electrical SpecificationsMaster Mode Table C-1 Measurement ConditionsLSB Master LSB OUT Table C-2 SPI Master Mode Timing CharacteristicsNum Characteristic Symbol Unit Min Typ Max Mosi Port DataSlave MSB Slave ModeInput SCK Input MisoSlave LSB OUT Table C-3 SPI Slave Mode Timing CharacteristicsNum Characteristic Symbol Unit Min Typ Mosi Input Slave MSB OUTPE2 Lstrb PE3 Noacc PE7 PIPO0 PIPO1, PE6,5 External Bus TimingGeneral Muxed Bus Timing Eclk PE4Pweh Table C-4 Expanded Bus Timing Characteristics 5V RangeTable C-5 Expanded Bus Timing Characteristics 3.3V Range 126 Appendix D Package Information 80-pin QFP package Figure D-1 80-pin QFP Mechanical Dimensions case no B52-pin Lqfp package Figure D-2 52-pin Lqfp Mechanical Dimensions case no D-03Section AE-AE Detail AD 48-pin Lqfp packageAppendix E Emulation Information 1 PK20 / XADDR1614 112-pin Lqfp package 134 Device User Guide End Sheet 136