Motorola MC9S12C-Family warranty 9 I/O Characteristics, Table A-5 Thermal Package Characteristics1

Device User Guide — 9S12C128DGV1/D V01.05

Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.

Table A-5 Thermal Package Characteristics1

Num	C	Rating	Symbol	Min	Typ	Max	Unit
1	T	Thermal Resistance LQFP48, single layer PCB2	θJA	-	-	69	oC/W
2	T	Thermal Resistance LQFP48, double sided PCB with	θJA	-	-	53	oC/W
		2 internal planes3
3	T	Junction to Board LQFP48	θJB			30	oC/W
4	T	Junction to Case LQFP48	θJC			20	oC/W
5	T	Junction to Package Top LQFP48	ΨJT			4	oC/W
6	T	Thermal Resistance LQFP52, single sided PCB	θJA	-	-	65	oC/W
7	T	Thermal Resistance LQFP52, double sided PCB with	θJA	-	-	49	oC/W
		2 internal planes
8	T	Junction to Board LQFP52	θJB			31	oC/W
9	T	Junction to Case LQFP52	θJC			17	oC/W
10	T	Junction to Package Top LQFP52	ΨJT			3	oC/W
11	T	Thermal Resistance QFP 80, single sided PCB	θJA	-	-	52	oC/W
12	T	Thermal Resistance QFP 80, double sided PCB with	θJA	-	-	42	oC/W
		2 internal planes
13	T	Junction to Board QFP80	θJB			28	oC/W
14	T	Junction to Case QFP80	θJC			18	oC/W
15	T	Junction to Package Top QFP80	ΨJT			4	oC/W
NOTES:

1.The values for thermal resistance are achieved by package simulations

2.PC Board according to EIA/JEDEC Standard 51-2

3.PC Board according to EIA/JEDEC Standard 51-7

A.1.9 I/O Characteristics

This section describes the characteristics of all I/O pins. All parameters are not always applicable, e.g. not all pins feature pull up/down resistances.

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