TMS320C6454

Fixed-Point Digital Signal Processor

www.ti.com

SPRS311A –APRIL 2006 –REVISED DECEMBER 2006

2 Device Overview

2.1 Device Characteristics

Table 2-1, provides an overview of the C6454 DSP. The tables show significant features of the C6454 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.

Table 2-1. Characteristics of the C6454 Processor

PRODUCT PREVIEW

Peripherals

Not all peripherals pins are available at the same time (For more detail, see the Device Configuration section).

On-Chip Memory

C64x+ Megamodule Revision ID

JTAG BSDL_ID

Frequency

Cycle Time

Voltage

PLL1 and PLL1

Controller Options

PLL2

BGA Package

Process Technology

Product Status(1)

HARDWARE FEATURES

EMIFA (64-bit bus width)

(clock source = AECLKIN or SYSCLK4)

DDR2 Memory Controller (32-bit bus width) [1.8 V I/O] (clock source = CLKIN2)

EDMA3 (64 independent channels) [CPU/3 clock rate]

I2C

HPI (32- or 16-bit user selectable)

PCI (32-bit), [66-MHz or 33-MHz]

McBSPs (internal CPU/6 or external clock source up to 100 Mbps)

10/100/1000 Ethernet MAC (EMAC)

Management Data Input/Output (MDIO)

64-Bit Timers (Configurable)

(internal clock source = CPU/6 clock frequency)

General-Purpose Input/Output Port (GPIO)

Size (Bytes)

Organization

Megamodule Revision ID Register (address location: 0181 2000h)

JTAGID register (address location: 0x02A80008)

MHz

ns

Core (V)

I/O (V)

CLKIN1 frequency multiplier

CLKIN2 frequency multiplier

[DDR2 Memory Controller and EMAC support only]

24 x 24 mm

µm

Product Preview (PP), Advance Information (AI), or Production Data (PD)

C6454

1

1

1

1

1 (HPI16 or HPI32)

1 (PCI66 or PCI33)

2

1

1

2 64-bit or 4 32-bit

16

1144K

32K-Byte (32KB) L1 Program Memory Controller

[SRAM/Cache]

32KB Data Memory Controller [SRAM/Cache]

1048KB L2 Unified Memory/Cache

32KB L2 ROM

See Section 5.6, Megamodule Revision

See Section 3.6, JTAG ID (JTAGID) Register

Description

720, 850, and 1000 (1 GHz)

1.39ns (C6454-720), 1.17 ns (C6454-850), 1 ns (C6454-1000) [1 GHz CPU]

1.25V (-1000)

1.2V (-850/-720)

1.5/1.8 [EMAC RGMII], and

1.8and 3.3 V [I/O Supply Voltage] Bypass (x1), x15, x20, x25, x30, x32

x20

697-Pin Flip-Chip Plastic BGA (ZTZ)

697-Pin Plastic BGA (GTZ)

0.09µm

PP

(1)PRODUCT PREVIEW information concerns experimental products (designated as TMX) that are in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.

6

Device Overview

Submit Documentation Feedback

Page 6
Image 6
Texas Instruments TMS320C6454 warranty Device Characteristics, Characteristics of the C6454 Processor, Hardware Features