TMS320C6454

Fixed-Point Digital Signal Processor

www.ti.com

SPRS311A –APRIL 2006 –REVISED DECEMBER 2006

8 Mechanical Data

8.1 Thermal Data

Table 8-1shows the thermal resistance characteristics for the PBGA - ZTZ/GTZ mechanical package.

Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [ZTZ/GTZ]

NO.

 

 

°C/W

AIR FLOW

 

 

 

 

 

(m/s (1))

 

1

RΘJC

Junction-to-case

1.45

N/A

 

2

RΘJB

Junction-to-board

8.34

N/A

 

3

 

 

16.1

0.00

 

4

RΘJA

Junction-to-free air

13.0

1.0

 

5

11.9

2.0

 

 

 

 

6

 

 

10.7

3.0

 

 

 

 

0.37

0.00

 

7

PsiJT

Junction-to-package top

0.89

1.0

 

1.01

1.5

 

 

 

 

 

 

 

 

1.17

3.00

PREVIEW

 

 

 

7.6

0.00

 

 

 

 

8

PsiJB

Junction-to-board

6.7

1.0

 

6.4

1.5

 

 

 

 

 

 

 

 

5.8

3.00

 

(1) m/s = meters per second

 

 

 

8.2

Packaging Information

 

 

PRODUCT

 

The following packaging information reflects the most current released data available for the designated

 

 

device(s). This data is subject to change without notice and without revision of this document.

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Mechanical Data

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Texas Instruments TMS320C6454 warranty Thermal Data, Packaging Information, AIR Flow, Product