Electrical Specifications

32581C

9.2

DC Characteristics

 

Table 9-10describes the signal buffer types of the SC3200.

The subsections that follows provide detailed DC charac-

(See Table 3-2 "BGD432 Ball Assignment - Sorted by Ball

teristics according to buffer type.

Number" on page 29 and Table 3-2 "BGU481 Ball Assign-

 

ment - Sorted by Ball Number" on page 29) for each sig-

 

nal’s buffer type.)

Table 9-10. Buffer Types

Symbol

Description

Reference

 

 

 

Diode

Diodes only, no buffer

---

 

 

 

INAB

Input, ACCESS.bus compatible with Schmitt Trigger

Section 9.2.1

 

 

 

INBTN

Input, TTL compatible with Schmitt Trigger, low leakage

Section 9.2.2

INPCI

Input, PCI compatible

Section 9.2.3

INSTRP

Input, Strap ball (min VIH is 0.6VIO) with weak pull-down

Section 9.2.4

INT

Input, TTL compatible

Section 9.2.5

 

 

 

INTS

Input, TTL compatible with Schmitt Trigger type 200 mV

Section 9.2.6

 

 

 

INTS1

Input, with Schmitt Trigger type 200 mV

Section 9.2.7

INUSB

Input, USB compatible

Section 9.2.8

OAC97

Output, Totem-Pole, AC97 compatible

Section 9.2.9

ODn

Output, Open-Drain, capable of sinking n mA.Note 1

Section 9.2.10

 

 

 

ODPCI

Output, Open-Drain, PCI compatible

Section 9.2.11

Op/n

Output, Totem-Pole, capable of sourcing p mA and sinking n mA

Section 9.2.12

OPCI

Output, PCI compatible, TRI-STATE

Section 9.2.13

OUSB

Output, USB compatible

Section 9.2.14

TSp/n

Output, TRI-STATE, capable of sourcing p mA and sinking n mA

Section 9.2.15

WIRE

Wire, no buffer

---

 

 

 

Note 1.Output from these signals is open-drain and cannot be forced high.

AMD Geode™ SC3200 Processor Data Book

357

Page 357
Image 357
AMD SC3200 manual DC Characteristics, Buffer Types, Symbol Description Reference, Wire