Package Specifications

32581C

10.2Physical Dimensions

The figures in this section provide the mechanical package outline for the BGU481 (481-Terminal Ball Grid Array Cavity Up) package.

Figure 10-2. BGU481 Package - Top View

AMD Geode™ SC3200 Processor Data Book

423

Page 423
Image 423
AMD manual Physical Dimensions, AMD Geode SC3200 Processor Data Book 423