Texas Instruments TMS320F28016, TMS320F2808 TMS320F2809ZGMA Active, TMS320F2809ZGMS Active

PACKAGE OPTION ADDENDUM

www.ti.com

5-Nov-2010

Orderable Device

Status

(1)

Package Type

Package

Pins

Package Qty

Eco Plan

(2)

Lead/

MSL Peak Temp

(3)

Samples

Drawing

Ball Finish

(Requires Login)

TMS320F2809PZA

ACTIVE

LQFP

PZ

100

90

Green (RoHS

CU NIPDAU

Level-2-260C-1 YEAR

& no Sb/Br)

TMS320F2809PZQ

ACTIVE

LQFP

PZ

100

1

Green (RoHS

CU NIPDAU

Level-2-260C-1 YEAR

& no Sb/Br)

TMS320F2809PZS

ACTIVE

LQFP

PZ

100

90

Green (RoHS

CU NIPDAU

Level-2-260C-1 YEAR

& no Sb/Br)

TMS320F2809ZGMA

ACTIVE

BGA

ZGM

100

1

Green (RoHS

SNAGCU

Level-3-260C-168 HR

MICROSTAR

& no Sb/Br)

TMS320F2809ZGMS

ACTIVE

BGA

ZGM

100

184

Green (RoHS

SNAGCU

Level-3-260C-168 HR

MICROSTAR

& no Sb/Br)

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances,including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceedthe total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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