Texas Instruments TMS320F28015, TMS320F2809, TMS320F2808, TMS320C2802, TMS320C2801 Migration Issues

TMS320F2809, TMS320F2808, TMS320F2806

TMS320F2802, TMS320F2801, TMS320C2802

TMS320C2801, TMS320F28016, TMS320F28015

www.ti.com SPRS230L –OCTOBER 2003 –REVISED DECEMBER 2009

7 Migrating From F280x Devices to C280x Devices

7.1Migration Issues

The migration issues to be considered while migrating from the F280x devices to C280x devices are as follows:

•The 1K OTP memory available in F280x devices has been replaced by 1K ROM C280x devices.

•Current consumption differs for F280x and C280x devices for all four possible modes. See the appropriate electrical section for exact numbers.

•The VDD3VFL pin is the 3.3-V Flash core power pin in F280x devices but is a VDDIO pin in C280x devices.

•F280x and C280x devices are pin-compatible and code-compatible; however, they are electrically different with different EMI/ESD profiles. Before ramping production with C280x devices, evaluate performance of the hardware design with both devices.

•Addresses 0x3D 7BFC through 0x3D 7BFF in the OTP and addresses 0x3F 7FF0 through 0x3F 7FF5 in the main ROM array are reserved for ROM part-specific information and are not available for user applications.

•The paged and random wait-state specifications for the Flash and ROM parts are different. While migrating from Flash to ROM parts, the same wait-state values must be used for best-performance compatibility (for example, in applications that use software delay loops or where precise interrupt latencies are critical).

•The analog input switch resistance is smaller in C280x devices compared to F280x devices. While migrating from a Flash to a ROM device care should be taken to design the analog input circuits to meet the application performance required by the sampling network.

•The PART-ID register value is different for Flash and ROM parts.

•From a silicon functionality/errata standpoint, rev A ROM devices are equivalent to rev C flash devices. See the errata applicable to 280x devices for details.

•As part of the ROM code generation process, all unused memory locations in the customer application are automatically filled with 0xFFFF. Unused locations should not be manually filled with any other data.

For errata applicable to 280x devices, see the TMS320F280x, TMS320C280x, and TMS320F2801x DSC Silicon Errata (literature number SPRZ171).

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TMS320C2801 TMS320F28016 TMS320F28015