Texas Instruments TMS320F2802, TMS320F2809, TMS320F2808 Xclkin Timing Requirements PLL Enabled

TMS320F2809, TMS320F2808, TMS320F2806

TMS320F2802, TMS320F2801, TMS320C2802

TMS320C2801, TMS320F28016, TMS320F28015

SPRS230L –OCTOBER 2003 –REVISED DECEMBER 2009				www.ti.com
6-9	XCLKIN Timing Requirements - PLL Enabled			105
6-10	XCLKIN Timing Requirements - PLL Disabled			105
6-11	XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)			105
6-12	Power Management and Supervisory Circuit Solutions			106
6-13	Reset		Timing Requirements	108
		(XRS)
6-14	General-Purpose Output Switching Characteristics			109
6-15	General-Purpose Input Timing Requirements			110
6-16	IDLE Mode Timing Requirements			112
6-17	IDLE Mode Switching Characteristics			112
6-18	STANDBY Mode Timing Requirements			113
6-19	STANDBY Mode Switching Characteristics			113
6-20	HALT Mode Timing Requirements			114
6-21	HALT Mode Switching Characteristics			114
6-22	ePWM Timing Requirements			115
6-23	ePWM Switching Characteristics			115
6-24	Trip-Zone input Timing Requirements			115
6-25	High-Resolution PWM Characteristics at SYSCLKOUT = (60–100 MHz)			116
6-26	Enhanced Capture (eCAP) Timing Requirement			116
6-27	eCAP Switching Characteristics			116
6-28	Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements			116
6-29	eQEP Switching Characteristics			116
6-30	External ADC Start-of-Conversion Switching Characteristics			117
6-31	External Interrupt Timing Requirements			117
6-32	External Interrupt Switching Characteristics			117
6-33	I2C Timing			118
6-34	SPI Master Mode External Timing (Clock Phase = 0)			119
6-35	SPI Master Mode External Timing (Clock Phase = 1)			121
6-36	SPI Slave Mode External Timing (Clock Phase = 0)			123
6-37	SPI Slave Mode External Timing (Clock Phase = 1)			124
6-38	ADC Electrical Characteristics (over recommended operating conditions)			125
6-39	ADC Power-Up Delays			126
6-40	Current Consumption for Different ADC Configurations (at 12.5-MHz ADCCLK)			126
6-41	Sequential Sampling Mode Timing			128
6-42	Simultaneous Sampling Mode Timing			129
6-43	Flash Endurance for A and S Temperature Material			131
6-44	Flash Endurance for Q Temperature Material			131
6-45	Flash Parameters at 100-MHz SYSCLKOUT			131
6-46	Flash/OTP Access Timing			131
6-47	Minimum Required Flash/OTP Wait-States at Different Frequencies			132
6-48	ROM/OTP Access Timing			132
6-49	ROM/ROM (OTP area) Minimum Required Wait-States at Different Frequencies			132
9-1	F280x Thermal Model 100-pin GGM Results			135
9-2	F280x Thermal Model 100-pin PZ Results			135
9-3	C280x Thermal Model 100-pin GGM Results			135
9-4	C280x Thermal Model 100-pin PZ Results			135
9-5	F2809 Thermal Model 100-pin GGM Results			135
9-6	F2809 Thermal Model 100-pin PZ Results			136

8 List of Tables Copyright © 2003–2009, Texas Instruments Incorporated